Huawei unconventionally releasing its Mate 60 Pro 5G smartphone in late August witout prior notice garnered global attention, but during the subsequent official product launch event...
Previously, at the Code Conference held in California, AMD CEO Lisa Su discussed topics covering the AI industry, expansion of domestic semiconductor production in the US, Huawei's...
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
With Intel splitting its manufacturing and design divisions, competitors such as AMD and Nvidia are already considered as potential Intel customers, said Intel CEO Pat Gelsinger during...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
To ensure their competitiveness, vertical integration isn't merely a catchphrase for businesses; it's an ongoing imperative. When TSMC focuses on advanced packaging, what's ASE's...
Wistron has secured significant GPU substrate orders for AI servers and anticipates its server product shipments will increase month by month for the remainder of this year, according...
The road to recovery for personal computers (PCs) has been challenging coming off explosive years in 2020 and 2021, but signs of growth are finally returning. According to the IDC...
Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, expects its revenue to hit bottom for 2023 in the third or early fourth quarter...
The AI server frenzy remains unabated, allowing more and more related supply chain players to emerge. But amid the numerous companies claiming to be associated with AI servers, the...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, has seen its customers place orders with caution as a result of a slower-than-anticipated...