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    NEWS TAGGED AMD NEO
    Friday 16 January 2009
    AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
    AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
    Wednesday 7 January 2009
    AMD delivers new platform for ultra-thin notebooks
    AMD has announced the availability of an new AMD platform for ultra-thin notebooks.
    Vortex
    BIZ FOCUS
    Nov 1, 12:16
    Authme's face recognition technology safeguards against Deepfake attacks, ensuring the reliability of identity verification
    Friday 1 November 2024
    AI-powered video ads: how VidAU cuts production time and costs for marketers
    Thursday 31 October 2024
    To address rising generative AI cybersecurity concerns, OneDegree Global offers AI risk assessment services
    Thursday 31 October 2024
    Technology behind cryptocurrency casino bonuses: technical analysis of blockchain gaming
    RESEARCH INSIGHTS
    Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research