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    NEWS TAGGED AMD NEO
    Friday 16 January 2009
    AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
    AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
    Wednesday 7 January 2009
    AMD delivers new platform for ultra-thin notebooks
    AMD has announced the availability of an new AMD platform for ultra-thin notebooks.
    Colder Products Company
    BIZ FOCUS
    Nov 21, 09:56
    SK Hynix starts mass production of world's first 321-high NAND
    Thursday 21 November 2024
    Simmunome: Revolutionizing drug development with tech bio innovation
    Wednesday 20 November 2024
    VitalTracer's path to innovation: Revolutionizing remote patient monitoring
    Tuesday 19 November 2024
    From Canada to Asia: PragmaClin's mission to improve Parkinson's Disease diagnosis and care
    RESEARCH INSIGHTS
    Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research