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    Former NSTC minister argues users need AI software services, not computing power
    2h 4min ago
    HPC chip demand to boom for another 4 years
    2h 21min ago
    Foxconn, Mitac to gain from US AI infrastructure boom
    2h 24min ago
    Chinese foundries' offers remain less appealing to Taiwan IC design houses
    3h 55min ago
    Pegatron's Mexico plant to start production as scheduled, says chairman
    4h 16min ago
    Xiaomi and BYD challenge Tesla's dominance in China
    5h 1min ago
    Intel's Chromebook market share may fall below 65% despite an expanding market
    5h 8min ago
    Pegatron chairman positive about Trump's first day EOs
    5h 46min ago
    Logic IC packaging house Greatek 4Q24 revenue exceeds estimates
    6h 4min ago
    NEWS TAGGED AMD NEO
    Friday 16 January 2009
    AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
    AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
    Wednesday 7 January 2009
    AMD delivers new platform for ultra-thin notebooks
    AMD has announced the availability of an new AMD platform for ultra-thin notebooks.
    BIZ FOCUS
    Jan 22, 12:31
    Asia planning on PSTN retirement to take digital leap
    Wednesday 22 January 2025
    Innovative developments in the newest casinos in the Netherlands
    Monday 20 January 2025
    7 Reasons Why iGamers Are Choosing Sweepstakes Over Regular Online Casinos
    Monday 20 January 2025
    Smart glasses in 2025: The rise of lifestyle-first wearables
    RESEARCH INSIGHTS
    Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research