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    NEWS TAGGED AMD NEO
    Friday 16 January 2009
    AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
    AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
    Wednesday 7 January 2009
    AMD delivers new platform for ultra-thin notebooks
    AMD has announced the availability of an new AMD platform for ultra-thin notebooks.
    filusch fiore kommunikations.design GmbH
    BIZ FOCUS
    Dec 20, 11:09
    Supermicro H14 servers empower the next generation of AI workloads
    Friday 20 December 2024
    Swisstech to announce Step into Future and Experience Swiss AI Innovation at CES 2025 in Las Vegas
    Wednesday 18 December 2024
    AWS partners with Kaohsiung City government to drive industrial upgrades and build a new digital economy with innovative AI
    Wednesday 18 December 2024
    Photolithography: What IC substrate manufacturers need to know
    RESEARCH INSIGHTS
    Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research