Applied Materials and Japan-based Disco have announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSVs) in 3-dimensional (3D) semicond...
Taiwan Semiconductor Manufacturing Company(TSMC) has recently announced purchases of machinery equipment from Applied Materials Asia-Pacific, Dainippon Screen Manufacturing and KLA-Tencor...
Taiwan Semiconductor Manufacturing Company (TSMC) has recently announced the purchase of machinery equipment from Applied Materials Asia-Pacific and Tokyo Electron, totaling NT$1.02...
Taiwan Semiconductor Manufacturing Company (TSMC) has announced an equipment purchase worth NT$587.09 million (US$16.86 million) from Lam Research, a supplier of semiconductor wafer...
Applied Materials has announced that it is undertaking a major effort to enable the widespread adoption of through-silicon vias (TSVs), a rapidly-emerging approach for vertically...
Applied Materials has announced its Applied Aera2 for lithography system. Using the system's IntenCD technology in the fab, semiconductor manufacturers can improve wafer critical...
Applied Materials has href="http://www.businesswire.com/portal/site/appliedmaterials/index.jsp?ndmViewId=news_view&ndmConfigId=1002082&newsId=20081112006305&newsLang=en"...
Despite the rapid decline of oil prices and a slowdown in the semiconductor and FPD (flat-panel display) industries recently, global investment in solar energy has continued to build...
Applied Materials has announced that it has signed a five-year service contract with Green Energy Technology (GET) of Taiwan to support GET's Applied SunFab thin film line for solar...
Applied Materials held a groundbreaking for an expansion project of its Tainan Manufacturing Center. This expansion, with a total investment estimated at around US$17 million, will...
