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REALTIME NEWS
US May Tighten Grip on EDA Access — What It Could Mean for China’s Chip Future
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Tuesday 5 March 2024
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Friday 29 December 2023
China MLCC expansion and measures of Japan
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Wednesday 27 December 2023
Challenges remain for Samsung handsets in India amid export expansion, says DIGITIMES Research
Samsung Electronics has significantly increased its handset exports from India in recent years. According to DIGITIMES Research, whether Samsung will keep expanding exports from India...
Monday 25 December 2023
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Wednesday 20 December 2023
NTT innovative optical wireless network in Japan
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Tuesday 19 December 2023
Vietnam semiconductor industry potential (Part 2)
Power supply
Friday 15 December 2023
Vietnam semiconductor industry potential (Part 1)
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Friday 3 November 2023
Status of South Korea 5G network (Part 2)
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Thursday 26 October 2023
Status of South Korea 5G network (Part 1)
Introduction
Thursday 19 October 2023
South Korea K-Network 2030 Strategy (Part 3)
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Friday 25 August 2023
South Korea K-Network 2030 strategy (Part 2)
Introduction
Wednesday 19 July 2023
South Korea K-Network 2030 strategy (Part 1)
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Wednesday 5 July 2023
Statuses of Japan 5G network deployment
Introduction
Friday 16 June 2023
Statuses of India telecom industry
Introduction
Tuesday 23 May 2023
Statuses of Japan IC substrate industry
Introduction
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BIZ FOCUS
May 29, 14:53
Pegatron debuted independently at Computex 2025,
showcasing AI and smart manufacturing capabilities to establish itself as a leading design and manufacturing services brand
Thursday 29 May 2025
Pegatron unveiled Verge: Cutting-edge AI hardware-ready AR smart glasses reference design at COMPUTEX 2025
Thursday 29 May 2025
PEGATRON unveils groundbreaking AI and digital transformation initiatives at GTC Taipei 2025
Thursday 29 May 2025
DATOTEK showcases AI-era memory & storage at COMPUTEX 2025, featuring immersive design and Switch 2-ready innovations
MOST-READ
7 DAYS NEWS
TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Lip-Bu Tan's Intel: leaner, flatter, and betting big on packaging
Intel CEO's four turnaround strategies unveiled
Huawei reportedly erects three advanced chip fabs in Shenzhen to sidestep foreign tech
D-Link sidesteps China rivalry with a Taiwan-first supply chain
MediaTek eyes $40B cloud ASIC bonanza as next growth engine
Samsung activates crisis planning, lines up US$7.27 billion in bank credit
Foxconn's Young Liu wants to export more than iPhones
Winbond ramps up in the DRAM shake-up, but trade fears loom
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
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