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Thursday 2 October 2008
Tessera licenses TSV technology to Korea-based packaging house
Tessera Technologies has announced today that Advanced Wafer Level Packaging Inc. (AWLP) has licensed its full range of Shellcase image sensor packaging technologies, including its...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research