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Wednesday 4 September 2019
CHPT to challenge 30-40% sequential revenue rise for 3Q19
IC testing solution provider Chunghwa Precision Test Tech (CHPT) saw its consolidated revenues for August 2019 increase 7.4% sequentially and 16.1% on year to a record high of NT$367...
Monday 19 August 2019
China smartphone AP shipments – 2Q 2019

Introduction

Monday 12 August 2019
IC backend supply chain to thrive on 5G smartphone penetration
With Qualcomm aggressively offering multiple APs, baseband chips and RF front-end modules (FEMs) to tap the 5G smartphone market, its Taiwan-based backend service providers including...
Thursday 8 August 2019
High-end CCL demand from Huawei ramping up
High-end CCL demand from Huawei has been rising due to a major redesign of its 5G base station infrastructure, prompting Taiwan CCL makers to upgrade their CCL specs to meet the demand,...
Wednesday 7 August 2019
CHPT 2H19 revenues to surge on China 5G infrastructure construction
Taiwan-based IC testing solution provider Chunghwa Precision Test Tech (CHPT) is expected to see revenue growth significantly driven by Chinese telecom operators upgrading existing...
Monday 29 July 2019
Apple revving up in-house IC design capability; TSMC to benefit most
Apple has clinched a deal to acquire Intel's smartphone baseband (modem) chip business unit, and the US vendor is also expected to roll out MacBook models featuring its own ARM-based...
Wednesday 19 June 2019
FPCB maker Flexium tapping 5G, IoT application opportunities
Flexible PCB specialist Flexium Interconnect is looking to explore more application opportunities for its products beyond handsets, especially those for use in 5G and IoT devices,...
Tuesday 12 February 2019
TMYTek launches 5G beamforming solutions
TMY Technology (TMYTek), founded in 2014 to develop active and passive mmWave components, has just launched 5G beamforming technology solutions that can help address problems encountered...
Friday 7 December 2018
MediaTek showcases Helio M70 5G baseband chipset at China event
MediaTek showcased at the China Mobile Global Partner Conference in Guangzhou on December 6 its first 5G baseband chipset Helio M70, which was launched in mid 2018.
Tuesday 4 September 2018
Eight-inch fab capacity remains tight, says UMC president
Eight-inch fab capacity remains tight, whereas there is an excess of 12-inch fab capacity, according to SC Chien, co-president for pure-play foundry United Microelectronics (UMC).
Thursday 16 August 2018
China smartphone AP shipments – 2Q 2018

Introduction

Wednesday 11 April 2018
Tsinghua Unigroup readies CNY370 billion for chip deployments in next 5 years, says chairman
China's Tsinghua Unigroup has readied CNY370 billion (US$58.74 billion) to support its semiconductor deployments in the next five years, and plans to inject up to US$100 billion into...
Monday 5 March 2018
Compound semiconductor suppliers set to benefit from 5G
Taiwan suppliers of compound semiconductor devices are poised to gain significant growth momentum from the increasing market demand for radio frequency (RF) and power amplifier (PA)...
Friday 2 February 2018
Mobile SoC designs, embedded processing lift microprocessor market
The fastest growing types of microprocessors in 2012-2017 were mobile system-on-chip (SoC) designs for smartphones and tablets, and microprocessors used in embedded-processing applications,...