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Thursday 15 February 2024
Samsung embraces hybrid bonding for advanced non-memory packaging
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
Tuesday 2 January 2024
Dutch chip equipment supplier BE Semiconductor Industries sees soaring 2023 valuation driven by advanced packaging
Marking the beginning of 2024, DIGITIMES Asia compiled the list of the top 100 semiconductor companies based on their market values in dollar terms at the end of 2023. The median...
Wednesday 22 December 2021
BESI lowers 4Q21 revenue due to severe flooding in Malaysia
Leading manufacturer of assembly equipment for the semiconductor industry, BE Semiconductor Industries N.V. (Besi) announced that due to flooding affecting its main production facility...