CONNECT WITH US
NEWS TAGGED BROADCOM
Monday 27 June 2022
Competition poised to heat up in 3-horse race for 3/2nm processes
Foundry market competitions among TSMC, Samsung Electronics and Intel will heat up significantly as they are advancing to 3/2nm manufacturing nodes, and it seems that Samsung will...
Thursday 23 June 2022
TSMC sees major clients queue up for 3nm process capacity
TSMC has seen its major clients including AMD, Apple, Broadcom, Intel, MediaTek, Nvidia and Qualcomm queue up for 3nm process capacity, according to sources at fab toolmakers.
Friday 27 May 2022
Maxscend to commercialize production of SAW filters
China-based Maxscend Microelectronics, dedicated to supplying RF frontend chips such as RF switches and low-noise amplifiers, is set to kick off trial production of SAW (surface acoustic...
Tuesday 10 May 2022
TSMC, VIS performances to stay in high gear through 2025
Despite a slowdown in sales of consumer electronics devices such as handsets and notebooks, foundry houses seem to remain unscathed. In particular, TSMC and its affiliate Vanguard...
Tuesday 10 May 2022
IC inspection labs start fulfilling orders for Wi-Fi 7 SoCs
A leading chipmaker has kicked off its next-generation Wi-Fi SoC inspection and is expected to launch related module products as early as the fourth quarter of 2022, according to...
Wednesday 4 May 2022
Intel mulls adopting TSMC 5nm process in new Meteor Lake chips
Intel is evaluating a revision to its blueprints for the 14th Gen Core "Meteor Lake" CPUs by turning to TSMC's 5nm process family to manufacture all of the integrated chips, according...
Friday 29 April 2022
RichWave expects Wi-Fi SoC shortages to ease in 2H22
Taiwan-based RichWave Technology, which specializes in Wi-Fi FEM (front-end module) solutions, expects Wi-Fi core chip shortages to ease in the second half of 2022 significantly buoying...
Thursday 21 April 2022
Wi-Fi SoC shortages improving
Wi-Fi core chip suppliers have obtained more available fab capacities at foundries, which are experiencing cutbacks in orders from other areas, and therefore are seeing their tight...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Monday 11 April 2022
IC inspection labs see growing demand for Wi-Fi 7, 5G mmWave chips
As leading chipmakers including Qualcomm, MediaTek, Broadcom and Intel are keenly developing Wi-Fi 7 core chips and 5G mmWave mobile SoCs, Taiwan's IC inspection and certification...
Tuesday 29 March 2022
Testing houses see customers turn cautious
Dedicated testing houses including Sigurd Microelectronics and King Yuan Electronics (KYEC) have seen their customers increasingly adopt a wait-and-see attitude towards order commitments...
Tuesday 15 March 2022
MediaTek eyeing Wi-Fi SoCs as new growth driver
MediaTek will see Wi-Fi core chip business rising substantially to become its largest growth driver in 2022, helping offset weakness in handset chip demand so far this year, according...
Wednesday 9 March 2022
MediaTek seeing handset AP inventory swell
MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Friday 4 March 2022
RF FEM makers cut PA foundry orders for Wi-Fi applications
Taiwan's RF front-end module (FEM) makers, including RichWave Technology, have scaled down their wafer starts for power amplifiers (PA) with GaAS foundries such as Win Semiconductors...
megawin
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research