CONNECT WITH US
NEWS TAGGED BROADCOM
Wednesday 14 June 2023
TSMC CoWoS attracts orders from major HPC and network processor vendors
AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,
Tuesday 13 June 2023
Taiwan chipmakers see promising demand for AI HPC chips
Taiwanese foundries, OSATs, and other chipmakers are bracing for a surge in demand for AI high-performance computing (HPC) processors from US-based fabless vendors, such as Advanced...
Monday 12 June 2023
TSMC on track to double CoWoS capacity for AI GPU/HPC chips
With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
Monday 12 June 2023
IC designers, IP providers eyeing growing ASIC demand amid AI boom
AI has not only become the most important keyword in the entire tech industry but also driven major cloud service providers to gear up efforts to develop their own computing chips...
Tuesday 6 June 2023
Major semiconductor companies fighting against headwind of 2023 with competitive advantages
While AI continues to trend, the global semiconductor market in 2023 is still struggling to escape the downturn. This is mainly due to the memory market, which is expected to decline...
Monday 5 June 2023
TSMC planning 3–6% price hike starting in 2024
TSMC is contemplating a 3 to 6 percent price increase for its advanced process manufacturing beginning in January 2024, according to sources at IC design houses. The price increases...
Friday 2 June 2023
Broadcom expects AI revenue to be over 25% of semiconductor business in fiscal 2024
Broadcom said it also hopped on the bandwagon of the AI boom, predicting its AI revenue share would more than double in the coming years.
Thursday 25 May 2023
New Apple-Broadcom deal gets three interpretations from RF supply chain in Taiwan
The signing of a long-term contract between Apple and Broadcom to develop 5G radio frequency (RF) components could easily drive outsiders to associate it with the "coopetition" relationships...
Wednesday 24 May 2023
Apple and Broadcom sign multi-year deal to develop made-in-USA chips
In a bid to diversify away from chips made in Asia, Apple announced a multi-billion-dollar multi-year deal with Broadcom to help the latter develop chips made in the US.
Monday 22 May 2023
ASE lands Broadcom orders for silicon photonics-based networking chips
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Monday 22 May 2023
Major customers confident about TSMC 2nm GAA process
Almost all of TSMC's top-10 customers have readied plans to adopt the foundry's 2nm GAA-FET (gate-all-around field-effect transistor) process technology, to be commercialized in 2025...
Monday 8 May 2023
Silicon Island Chronicles series interview: Win Semi chairman says the era of AIoT has arrived
Apart from its TSMC-led silicon-based semiconductor ecosystem, Taiwan also plays a crucial role in the development of compound semiconductors, including the second-generation semiconductors...
Thursday 27 April 2023
OSATs see orders cut from fabless vendors
OSATs have experienced substantial cutbacks in orders for midrange chips from vendors including AMD and Broadcom, according to industry sources.
Friday 21 April 2023
TSMC betting on Apple orders to bolster 2H23 growth too risky, say observers
TSMC's latest earnings call conference has released mixed messages in the eyes of market observers. On the one hand, they are upbeat about the foundry maintaining its capex for the...
Tuesday 18 April 2023
Chip suppliers see slight pick-up in orders for Android smartphones
Radio-frequency (RF) and power amplifier (PA) chip suppliers have noticed a slight pick-up in orders for Android smartphones as related brand vendors prepare for China's approaching...