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Thursday 13 July 2023
Broadcom gets nod from EU to acquire VMware
The European Commission approved Broadcom's acquisition deal of VMware with open access and interoperability conditions. VMware is still waiting for FTC's approval on its way to diversify...
Monday 3 July 2023
TSMC sees robust AI chip orders from Nvidia, Broadcom, AMD through 2024
TSMC is expected to see a significant revenue rebound in the second half of the year, which will be driven by not only the launch of new iPhones but also strong demand for AI chips...
Thursday 29 June 2023
TSMC to see fab utilization rates rise substantially
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
Monday 26 June 2023
TSMC to build new CoWoS capacity in central Taiwan
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Monday 26 June 2023
Broadcom announces availability of second-generation Wi-Fi 7 wireless connectivity chips
Broadcom has announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways,...
Monday 19 June 2023
TSMC sees major clients restart order placements for 2024, advanced process utilization rebounding
TSMC has seen its capacity utilization rates for advanced processes below 7nm rebound slowly since June, and is poised to embrace a new wave of chip demand growth in 2024 as major...
Wednesday 14 June 2023
TSMC CoWoS attracts orders from major HPC and network processor vendors
AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,
Tuesday 13 June 2023
Taiwan chipmakers see promising demand for AI HPC chips
Taiwanese foundries, OSATs, and other chipmakers are bracing for a surge in demand for AI high-performance computing (HPC) processors from US-based fabless vendors, such as Advanced...
Monday 12 June 2023
TSMC on track to double CoWoS capacity for AI GPU/HPC chips
With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
Monday 12 June 2023
IC designers, IP providers eyeing growing ASIC demand amid AI boom
AI has not only become the most important keyword in the entire tech industry but also driven major cloud service providers to gear up efforts to develop their own computing chips...
Tuesday 6 June 2023
Major semiconductor companies fighting against headwind of 2023 with competitive advantages
While AI continues to trend, the global semiconductor market in 2023 is still struggling to escape the downturn. This is mainly due to the memory market, which is expected to decline...
Monday 5 June 2023
TSMC planning 3–6% price hike starting in 2024
TSMC is contemplating a 3 to 6 percent price increase for its advanced process manufacturing beginning in January 2024, according to sources at IC design houses. The price increases...
Friday 2 June 2023
Broadcom expects AI revenue to be over 25% of semiconductor business in fiscal 2024
Broadcom said it also hopped on the bandwagon of the AI boom, predicting its AI revenue share would more than double in the coming years.
Thursday 25 May 2023
New Apple-Broadcom deal gets three interpretations from RF supply chain in Taiwan
The signing of a long-term contract between Apple and Broadcom to develop 5G radio frequency (RF) components could easily drive outsiders to associate it with the "coopetition" relationships...
Wednesday 24 May 2023
Apple and Broadcom sign multi-year deal to develop made-in-USA chips
In a bid to diversify away from chips made in Asia, Apple announced a multi-billion-dollar multi-year deal with Broadcom to help the latter develop chips made in the US.