Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy...

In a fierce race with TSMC and Intel to develop next-generation chipmaking processes, Samsung Electronics is reportedly accelerating its adoption of BackSide Power Delivery Network...

As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current...