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Friday 18 October 2024
US faces nuclear power expansion challenges amid net-zero push
The US Department of Energy estimates the country will need to add 200 GW of nuclear capacity by 2050 to meet its net-zero targets and phase out coal-fired power plants. That translates...
Friday 18 October 2024
Taiwan targets low-carbon power to fuel industrial growth
Reliable access to low-carbon and zero-carbon energy has become a top priority for companies investing in manufacturing facilities in Taiwan. With rising global pressures to combat...
Friday 18 October 2024
AI demand is substantial and intense, says TSMC CEO
Chip demand for AI is substantial and intense, according to TSMC chairman and CEO C. C. Wei. TSMC's revenue from AI server chips is forecast to increase by over threefold in 2024...
Thursday 17 October 2024
ASML slashes 2025 forecast as chip industry adjusts to post-pandemic realities
ASML's significant decline in net bookings indicates the semiconductor industry's adaptation to post-pandemic market conditions, which were previously disrupted by global chip supply...
Wednesday 16 October 2024
Wolfspeed secures US$750 million funding for US SiC production expansion
Wolfspeed, a US-based silicon carbide (SiC) chipmaker, has secured up to US$750 million in federal funding to construct a new wafer plant in North Carolina and expand its New York...
Wednesday 16 October 2024
AUO dismisses speculation about FOPLP deployments
Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.
Wednesday 16 October 2024
ASML's order plunge suggests Intel and Samsung pullback, potentially benefiting TSMC
ASML's latest financial results revealed that some chipmakers have slowed their investments. Analysts speculate that Intel and Samsung may be the ones cutting back, potentially easing...
Wednesday 16 October 2024
TSMC raises CoWoS output goal again, say sources
TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...