Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...

Samsung Electronics, fresh off completing sixth-generation HBM4 development, is reportedly accelerating DRAM capacity expansion in a renewed effort to reclaim leadership in AI memo...

Taiwan's dedicated chip backend house Lingsen Precision Industries is stepping up capacity expansion and price adjustments as AI-fueled demand for memory chip testing accelerates....

Samsung Electro-Mechanics is set to increase its AI server multilayer ceramic capacitor (MLCC) production by expanding capacity at its Calamba City plant in the Philippines starting...

Tokyo Electron (TEL)—a long-time close partner of TSMC and a frequent awardee—did not appear on the chipmaker's 2025 Excellent Performance Awards list. The absence is likely...

South Korea's SK Hynix is reportedly considering establishing a memory chip assembly and testing (ATMP) facility in India. However, the company's recent public announcement of investment...

Japanese ceramics firm NGK Insulators has announced plans to triple its production capacity of support wafers by fiscal year 2027 (April 2027-March 2028). More specifically, these...

Ofuna Technology, a provider of PCB laser drilling equipment and processing services, reported a surge in demand driven by the AI industry wave during an investor briefing on November...

Facing intense competition in China's new energy vehicle market, electric vehicle leader BYD has clearly shifted its operational focus toward overseas markets to sustain high growth...