Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...
IC substrate maker Kinsus Interconnect Technology expects its capex budget to reach a record NT$4.5-5 billion (US$150.7-167.5 million) in 2013 and further climb to NT$5-6 billion...
LED lighting demand has been rising and Taiwan-based LED packaging house Edison Opto noted that 2013 capex will reach NT$400-500 million (US$13-16 million).
Intel, Samsung Electronics, Taiwan Semiconductor Manufacturing Company (TSMC), Texas Instruments (TI), Toshiba, Renesas Electronics, SK Hynix, and STMicroelectronics were among the...
Fab equipment spending for the second half of 2013 is expected to be much stronger with a 32% growth rate or US$18.5 billion compared to the first half of the year, according to SEMI...
Samsung Electronics is expected to spend US$6 billion on its logic IC business in 2013, down from a record US$7 billion in 2012, according to Digitimes Research.
IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...
Although global capital spending this year in the solar supply chain is expected to fall to its lowest level since 2006, indications signal that the downturn in investment has hit...
ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects its capex for 2013 to total NT$2.5-2.8 billion (US$83.6-93.6 million)...
Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled plans to invest a record US$1.5 billion on research and development in 2013. The spending remains focused on maintaining...
The board of directors of Macronix International, a manufacturer of mask ROM and NOR flash memory, has approved plans to budget NT$2.62 billion (US$88.7 million) in capex for 2013...
China Mobile has set aside a capex budget of CNY41.7 billion (US$6.7 billion) for procurement of about 200,000 TD-LTE base stations and related equipment in 2013 to deploy its TD-LTE...
The decision by Taiwan Semiconductor Manufacturing Company (TSMC) to raise its 2013 capex to US$9.5-10 billion, from US$9 billion set previously, will benefit Taiwan-based suppliers...
TSMC's 16nm FinFET process will enter mass production in less than one year after ramping up production of 20nm chips, company chairman and CEO Morris Chang said at an investors meeting...
Taiwan-based Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has unveiled plans to issue overseas convertible bonds worth up to...
