LED optical lens maker Ledlink is optimistic about the second quarter, as order visibility is clear to April-May. Telung Tang, CEO of the firm, noted that 2013 capex will reach NT$200...
The combined capital spending by Samsung Electronics and Intel is forecast to represent 42% of the world's semiconductor capital outlay in 2013, up from 40% in 2012, according to...
Taiwan Semiconductor Manufacturing Company (TSMC) plans to issue US$1.5 billion worth of unsecured corporate bonds overseas, according to a recent Economic Daily News report...
China Mobile, one of the biggest telecom carriers in China, reported 2012 total revenues of CNY560.4 billion (US$90 billion, up 6.1% on year. Net profits were CNY129.3 billion, representing...
Innolux Corporation plans to budget a capital expenditure (capex) of NT$20 billion (US$673 million) in 2013 to expand its 5G LCD panel production capacity. The expenditure could allow...
Far EasTone Telecommunications (FET), one of the three largest mobile telecom carriers in Taiwan, has set aside a capex budget of NT$10.5 billion (US$355 million) for 2013, the highest...
Spending on R&D by chip companies grew 7% in 2012 to a record-high US$53 billion even though the semiconductor market declined 1% to US$317.6 billion, according to IC Insights.
Major Taiwan-based PCB manufacturers including Unimicron Technology, Compeq Manufacturing and Unitech Printed Circuit Board have all set higher capex budgets for 2013, according to...
Memory chip vendors Samsung Electronics and SK Hynix have both taken a cautious approach to planning for capital expenditure (capex) in 2013, implying that the pair is looking to...
IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...
Chunghwa Telecom (CHT) has set aside a copmpany record capital expenditure (capex) budget of NT$37.15 billion (US$1.26 billion) for 2013, increasing 11.7% from 2012.
Walton Advanced Engineering, which provides packaging and testing services for memory chips, has expressed caution about its business outlook for 2013. Filling under-utilized capacity...
LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.
Flexible PCB manufacturer Flexium Interconnect expects its capex for 2013 to top the NT$1.7-1.8 billion (US$58.73-62.18 million) it spent in the previous year, with plans to upgrade...
IC packaging and testing house Sigurd Microelectronics expects to maintain its 2013 capex at the same level as 2012. The expenditures will be spent on expanding capacity and R&...
