Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...

China's homegrown semiconductor equipment makers are gearing up to develop diverse frontend and backend IC process equipment in line with the government efforts to boost self-sufficiency...

China-based CIS (CMOS image sensor) packaging service provider China Wafer Level CSP has posted consolidated revenues of CNY191 million (US$27.4 million) and net profit of CNY62 million...