Qualcomm reported slightly stronger-than-expected results over the past quarter, and its upbeat outlook suggests an improvement in the mobile phone industry. Qualcomm also expects...
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...
Huawei continues its relentless journey towards chip self-sufficiency, showcasing signs of China's further advancements in advanced manufacturing processes.
The US Department of Commerce and Micron Technology have signed a non-binding Preliminary Memorandum of Terms (PMT) to provide up to US$6.14 billion in direct funding under the CHIPS...
Intel has formed alliances with second-tier foundries including UMC and Tower Semiconductor to reduce costs and optimize production utilization, among other reasons, which may enhance...
American memory chip giant Micron Technology, which has not built a new fab in the US for 20 years, is expected to step up its construction of new manufacturing facilities in New...
