As the US presidential election heats up, speculation is swirling about whether former President Donald Trump, if re-elected, would cut off subsidies for TSMC's Fab 21 in Arizona...
Following the passage of significant legislation such as the CHIPS and Science Act (CHIPS Act) and the Inflation Reduction Act (IRA) in 2022, the United States has intensified its...
The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment...
ElevATE Semiconductor and Polar Semiconductor have formed a strategic alliance to develop and produce ElevATE products used by world-class ATE equipment and semiconductor manufactu...
On October 2, 2024, US President Joe Biden signed new legislation allowing semiconductor fabs funded under the CHIPS and Science Act to bypass federal environmental review requirements...
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
The trio of Intel CEO Pat Gelsinger, US President Joe Biden, and Commerce Secretary Gina Raimondo are on a mission to restore the former glory of the US semiconductor industry.
Two days before SEMICON India 2024, the US Department of State said that the US and India will explore opportunities, grow, and diversify the global semiconductor supply chain.
Yung-Chung Kao, chairman of compound semiconductor manufacturer IntelliEPI, announced that the company has secured a subsidy of US$4.1 million under the Texas CHIPS Act, which will...
The scope of the US Chips Act appears to have exceeded that of the China Integrated Circuit Industry Investment Fund II (Big Fund II), but the American government's goal of reshoring...
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
