Memory and logic IC backend house Powertech Technology (PTI) expects to post a low single-digit sequential decrease in fourth-quarter revenues, due mainly to a slowdown in memory...
Industrial PC maker Nexcom has built a smart manufacturing demonstration facility to showcase Industry 4.0 concept integrated with cloud computing in northern Taiwan.
With tremendous growth of smartphones over the past decade, foundry sales to the communications market have soared and are now forecast to account for about 3x more than IC foundry...
At its recent forum in Beijing, Xilinx introduced its FPGA-based acceleration solutions designed for artificial intelligence (AI) and data center applications. Dubbed Alveo, the acceleration...
Xilinx will mass roll out its next-generation 7nm FPGA chips in 2019, and TSMC and other Xilinx supply chain partners including Chunghwa Precision Test Tech (CHPT) and Answer Technology...
Globally leading IC designers are keen to develop 5G-related chipsets as the new generation mobile communications technologies are set to kick off commercial applications in 2020,...
The memory-chip market exhibited impressive growth in 2017 as undersupply drove up both the DRAM and NAND flash prices. However, oversupply has re-emerged this year casting a shadow...
Microsoft is planning to release its new Windows Server 2019 operating system worldwide in October and will completely stop support for Windows Server 2008 and 2008 R2 in 2020.
China's IC industry is expected to establish a solid foothold in five years and go on to become a top-three or top-four player globally in 2028-2030, according to Zhao Weiguo, chairman...
While Industry 4.0 is changing people's current and future way of working, Intel is moving to fully deploy its technologies in every IoT node to make entire IoT system boast the best...
Wonders Information, a major smart city service provider in Shanghai, China, is aggressively utilizing such newly emerging technologies as cloud computing, big data, IoT, and mobile...
Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...
