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Monday 20 July 2026
US and Chinese AI labs are quietly building on each other's models, even as distillation fight rages
The distillation dispute between US and Chinese AI labs has been framed as a one-way street: American firms accuse Chinese rivals of copying their models. However, a run of recent...
Monday 20 July 2026
Smart glasses race enters new phase as AI ecosystems eclipse hardware specs
The global smart glasses market is entering a decisive new stage in the second half of 2026, with competition expanding well beyond Meta's early dominance. Industry attention is rapidly...
Monday 20 July 2026
Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

Monday 20 July 2026
Merck ramps up AI semiconductor materials push as Level Up nears completion

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

Monday 20 July 2026
BYD targets Japan's Kei-car stronghold with low-cost EV challenge
BYD is pressing ahead with plans to enter Japan's all-electric kei-car market, stepping up promotional activity and appointing a brand ambassador in a sign of growing confidence about...
Monday 20 July 2026
Cloud competition in SEA shifts toward AI, sovereignty, and cost

Singapore's relatively neutral stance on cloud adoption is helping make performance, compliance, and value the main factors in global...

Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Saturday 18 July 2026
Trumpf recalibrates strategy as Chinese competition heats up in semiconductors, machine tools

Global suppliers are facing tougher competition as China's semiconductor and machine tool industries expand quickly, with implications...

Friday 17 July 2026
TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

Thursday 16 July 2026
TPV Technology expects first-half loss as costs rise and global competition intensifies
TPV Technology said it expects to remain in the red in the first half of 2026, underscoring how higher materials costs, supply chain shifts, and intense price competition could continue...
Tuesday 14 July 2026
Column: Physical AI's rivalry shifts from companies to states

At the Humanoids Summit in Tokyo at the end of May 2026, a conference that had originally focused on technology and commercialization...

Monday 13 July 2026
Yulon Nissan revenue hits five-month high on stronger June sales
Yulon Nissan reported June 2026 revenue on July 13, posting NT$1.236 billion(US$38.53 million), down 1.91% year on year but up 13.63% from May. The automaker said the monthly result...
Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Friday 10 July 2026
Nvidia’s Jensen Huang heads to Japan with RTX Spark as AI PC competition heats up

Nvidia CEO Jensen Huang will travel to Japan for an event celebrating the US chipmaker's three-decade relationship with Sega, revisiting...

Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...