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Monday 17 August 2026
Apple faces US pressure over potential Chinese memory chip sourcing
The Trump administration is pressing Apple to find alternatives to Chinese memory suppliers as the company weighs ways to navigate a global memory shortage that has sharply increased...
Monday 17 August 2026
FSC plans MLPC trial production by end-2026 in passive component push
FS said it plans to begin trial production and shipments of high-end MLPC stacked solid-state capacitors by the end of 2026 as it expands beyond plastic injection molding machines...
Sunday 16 August 2026
Taiwan Mobile launches tender offer for Systex, targeting majority control
Taiwan Mobile said on August 12 that its board approved a tender offer for Systex Corporation common shares through its wholly owned subsidiary Taiwan Cellular, with the goal of lifting...
Saturday 15 August 2026
Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Saturday 15 August 2026
Lotes sees tight supply, says demand remains intact

Connector maker Lotes is deepening its server business, with its server quick disconnect (QD) line set to enter mass production in July,...

Friday 14 August 2026
Compal lifts profit on AI PCs and servers as component costs rise
Compal Electronics said second-quarter 2026 revenue and profit increased as AI PCs and server demand offset higher memory and other component costs. The Taiwanese electronics maker...
Friday 14 August 2026
Hyundai's robot foundry bet outpaces its local supply chain

Hyundai Motor Group and the South Korean government are accelerating a KRW9 trillion (approx. US$6.3 billion) robot and AI investment...

Thursday 13 August 2026
Inventec posts record second-quarter profit as notebook margins narrow
Inventec reported record net profit and earnings per share in 2Q26, even as gross margin declined and supply constraints intensified. The Taiwan-based electronics manufacturer said...
Wednesday 12 August 2026
Nichidenbo sees MLCC supply tightness as AI pushes lead times to 36 weeks

Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications...

Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Tuesday 11 August 2026
Walsin sees B/B ratio hit 1.8, 2026 capex at NT$4B

Chiao Yu-Heng, chairman of Walsin Technology, said the passive component market has improved sharply, with some parts even in short...

Tuesday 11 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Tuesday 11 August 2026
Taiwan's AI server supply chain posts record July as growth spreads down the component tier

The latest indication of global demand for AI hardware comes not from a hyperscaler capex presentation, but from unaudited monthly...

Tuesday 11 August 2026
Catcher says notebook component shortages cut 2Q26 revenue
Catcher said shortages of electronic components hit notebook PC shipments in the second quarter of 2026, dragging revenue lower and pressuring margins. The Taiwanese supplier said...
Tuesday 11 August 2026
UMT sees LEO demand rebound, targets 20%+ satellite revenue growth in 2H26
Demand for low-Earth orbit (LEO) satellite communications continues to expand, supporting growth at satellite communications component supplier Universal Microwave Technology (UMT)...