Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces...
Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...
ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...
China-based CIS (CMOS image sensor) packaging service provider China Wafer Level CSP has posted consolidated revenues of CNY191 million (US$27.4 million) and net profit of CNY62 million...
CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries and Xintec are expanding capacity seeking to satisfy growing demand for multi-lens camera pho...
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the market, Taiwan's...
PCB and IC substrate supplier Unimicron Technology has decided to increase its capex budget this year by NT$2.32 billion (US$75.5 million) to total NT$8.3 billion, according to a...
Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
As demand for LED end devices has resumed growth amid shortages of LED chip supply, China's LED makers have recently begun expanding their capacities and local governments are also...
LED epiwafer and chip maker Epistar expects shipments of CSP (chip-scale packaging) LED chips for LCD TV backlighting to increase beginning third-quarter 2017, according to the com...
Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...
Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...
Genesis Photonics has been making efforts to promote FC CSP (flip chip chip scale packaging) for automotive headlights in a bid to bounce back from eight consecutive quarters of net...
LED epitaxial wafer and chip maker Epistar, in view of fast growing demand for CSP (chip scale package) LED chips used in TV backlighting, will expand production capacity to four...
