SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's highest 321-layer 1Tb triple-level cell 4D NAND...
Semiconductor giant Broadcom has introduced the third generation of its co-packaged optics (CPO) technology, significantly advancing...
Artificial intelligence (AI) is no longer confined to data centers. At Computex 2025 in Taipei, executives from Arm, Nvidia, and MediaTek...