CONNECT WITH US
NEWS TAGGED DATA CENTER
Thursday 11 September 2025
SEMICON Taiwan 2025: Infineon CEO reveals future opportunities in power semiconductors
Jochen Hanebeck, CEO of Infineon, emphasized the concept "no AI without power" during his keynote speech at the SEMICON Taiwan 2025 Master Forum. Power semiconductors play a critical...
Thursday 11 September 2025
Suzhou Everbright taps AI and data center demand, expands in Europe
Suzhou Everbright Photonics is betting on explosive demand from artificial intelligence (AI) and data centers to drive future growth, Chairman Dayong Min said in an interview with...
Wednesday 10 September 2025
OpenAI reportedly in talks to bring US$500 billion Stargate project to India, sparking data center expansion
The Economic Times, citing unnamed sources, reported that OpenAI is holding preliminary discussions with Indian data center firms, including Sify Technologies, Yotta Data...
Tuesday 9 September 2025
Microsoft signs US$19.4 billion deal with Nebius amid surging AI cloud demands
The artificial intelligence (AI) boom continues to drive unprecedented computing power demands. Microsoft has signed a five-year AI cloud computing agreement with Nebius valued at...
Monday 8 September 2025
AI data centers spark power squeeze: Taiwan's heavyweights race to deliver faster
The explosive growth of artificial intelligence (AI) is fueling a global boom in AI data centers, driving electricity demand to record highs. Taiwanese heavy electrical firms —...
Saturday 6 September 2025
Why integration decides winners in Taiwan's AI server supply chain
Global demand for artificial intelligence (AI) is surging, driving parallel growth in AI server deployment. Taiwanese firms, once regarded mainly as component suppliers, have moved...
Friday 5 September 2025
SKT launches massive AI data center to recover from cyberattack fallout
South Korean telecom giant SK Telecom (SKT) is doubling down on its artificial intelligence (AI) investments in the wake of a major hacking incident. The company has officially begun...
Friday 5 September 2025
Google reportedly explores combining TPU chips with Nvidia GPUs to cut costs and boost data center scaling
Google has reportedly been in talks with smaller CSPs to deploy its proprietary TPU chips alongside Nvidia Corporation's GPUs in data centers. This approach aims to reduce reliance...
Friday 5 September 2025
Aoi Electronics acquires Sharp's Mie factory to produce data center and packaging products
Aoi Electronics, a Japanese outsourced semiconductor assembly and test (OSAT) provider, has purchased Sharp's factory in Taki, Mie Prefecture, and will convert the site into a new...
Friday 5 September 2025
Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs)...
Thursday 4 September 2025
AMD, Anritsu partner to standardize high-speed testing for AI data centers
Japan's Anritsu has teamed up with US chipmaker AMD to launch an automated testing platform for next-generation high-speed transmission, targeting the surging demand from AI data...
Wednesday 3 September 2025
Infineon teams up with Nvidia on 800V data center power, eyes EUR1 billion AI business
As artificial intelligence transforms data centers worldwide, the spotlight has expanded beyond computing and networking to power semiconductors. AI chips draw enormous amounts of...
Wednesday 3 September 2025
TSMC surpasses Intel in US silicon photonics patents as chip industry ramps up initiatives
TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
Wednesday 3 September 2025
China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects...