According to sources in the server supply chain, Nvidia will soon begin shipping its new B100 and B200 chips. Mass production of servers equipped with these Blackwell architecture...

Samsung Electronics is reportedly shifting its focus from automotive chip development to AI chips amid plans for significant business reorganization. This strategic pivot comes as...

Lee Jong-ho, Korea's Minister of Science and ICT, reportedly arranged a meeting with semiconductor Electronic Design Automation (EDA) professionals to gain insights into the local...

Arm, the world's largest semiconductor IP company, is reportedly drafting a new blueprint for the AI era.

India-based IC design house and IP provider MosChip Technologies secured a deal to design a homegrown HPC chip made by TSMC, amid India's indigenization efforts in the AI era.

SMC Diode Solutions has recently celebrated the inauguration of its second power discrete fab in Nanjing, China.

At the TSMC 2024 Japan Technology Symposium held on June 28, besides discussing the previously announced A16 chip technology, TSMC also revealed that it achieved revenue growth in...

GlobalFoundries has acquired Tagore Technology's proprietary and production-proven power gallium nitride (GaN) IP portfolio to push the boundaries of efficiency and performance in...

Liquid cooling is widely used in newly built data centers, and L2L (liquid to liquid) architecture has been widely adopted, according to Taiwan-based cooling module maker Taisol El...

Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, has announced its participation in the Intel Foundry Accelerator Design Services.

In the evolving PC industry, Intel's dominance is challenged by Arm, reshaping market dynamics, and leaving Intel vulnerable on many fronts. Its new x86S architecture, a purely 64-bit...

Rain AI has recruited an Apple Inc. chip executive to lead hardware engineering, the second high-profile hire this month for a startup trying to design a new type of semiconductor...

Chip manufacturing is the primary source of the carbon footprint generated by electronic devices. To address this, German chip giant Infineon plans to calculate the carbon footprint...

Following the collaboration with Taiwan-based PSMC to build a 300mm wafer fab in India, Tata Electronics plans to expedite the operation of the fab with tools provided by Synopsys.

ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...