CONNECT WITH US
NEWS TAGGED DISCO
Monday 19 August 2024
Disco plans to set up subsidiary in India amid Indian chipmaking ambition
Japan-based semiconductor equipment supplier Disco plans to establish its presence in India, as India plans to build a chipmaking ecosystem amid the global diversification in semic...
Friday 3 May 2024
Japan takes ambitious action on advanced packaging technology to capture Chiplet and AI chip opportunities
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Tuesday 23 January 2024
Japan-based semiconductor equipment suppliers thrive with increased demand in China and generative AI
Major Japan-based semiconductor equipment saw their market capitalization more than double in 2023, with other suppliers reporting nearly doubling of their market valuations, highlighting...
Tuesday 16 January 2024
Disco plans investment for new semiconductor materials plant, responding to global demand surge
According to Nikkei, Japan-based semiconductor equipment provider Disco is anticipated to invest over JPY40 billion (US$273.8 million) to build a plant in Kure, Hiroshima...
Thursday 11 January 2024
Japan toolmaker Disco reports record R&D expenses, focuses on HBM, SiC wafer-cutting equipment
Japan's Disco Corp, with its 70-80% share of the global wafer cutting and grinding equipment market, experienced a remarkable threefold increase in market value within a year in 20...
Friday 5 January 2024
Gujarat in talks with Asian and American chipmakers for semiconductor investments
Ahead of the annual investor event held in Gujarat, a top official of India's western state said it had talked with several chipmakers in Japan, South Korea, and the US, looking to...
Thursday 3 August 2023
TSMC initiates fresh round of advanced packaging equipment orders
TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...
Tuesday 1 August 2023
Disco considering establishing lab in India amidst surge of semiconductor investments
After some semiconductor manufacturers are looking to invest in India, other players in the chip supply chain have begun exploring the feasibility of setting up shop in India, a country...
Friday 14 July 2023
Backend fab toolmakers see short lead-time orders from TSMC
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Friday 3 February 2023
Japanese chip equipment makers closely watch new export bans on China; Canon sees limited impacts
With US officials acknowledging that Washington has indeed been in talks with the Japanese and Dutch governments regarding new restrictions on semiconductor equipment exports to China,...
Wednesday 18 January 2023
Disco set to increase production capacity by 40% to meet wafer equipment demand
Japanese semiconductor equipment maker Disco has decided to increase the production capacity of its cutting and polishing equipment for wafers and electronic components. To do so,...
Tuesday 31 March 2009
Applied Materials and Disco to jointly develop wafer thinning process for TSV solutions
Applied Materials and Japan-based Disco have announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSVs) in 3-dimensional (3D) semicond...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research