LG Innotek recently showcased a prototype of AR glasses equipped with waveguide technology, garnering significant attention.

Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...

Glass substrate prices are expected to rise in the third quarter of 2024, reflecting the depreciation of the Japanese yen, the tight supply-demand balance, and profits made by some...

Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging...