TSMC has acquired Innolux's 5.5G LCD fab in Tainan, southern Taiwan, for NT$17.14 billion (US$530.8 million). The acquisition price is less than what the market had anticipated.
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
The New York Times recently published a piece expressing concern about the delay in the start of chip fabrication and sale at TSMC's Fab 21 in Arizona, despite the project...
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
China's leading foundries, SMIC and Hua Hong Semiconductor, have seen their newly added 12-inch production capacity fully utilized, absorbing a surge in domestic orders.
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
Infineon has built a new plant in Kulim Hi-Tech Park, Malaysia, dedicated to generating 8-inch silicon carbide (SiC) wafers. Here are five major takeaways from the new facility's...
China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...
Silicon wafer company GlobalWafers has revised its revenue growth projection for 2024 to a decline in the high single digits. The revision was downgraded for the second time this...
Reports indicate that China's DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing...
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
TSMC has notified clients of a 3-8% price increase for its 5nm and 3nm process manufacturing in 2025 to reflect escalating costs, according to sources at IC design houses.
