Memory design house Etron Technology has teamed up with US-based FGPA chipmaker Lattice Semiconductor on developing new miniaturized AI+DRAM platform for applications to terminal...
Robust orders for advanced fabrication and packaging services at TSMC have prompted the foundry to team up with Materials Analysis Technology (MA-tek) and Integrated Service Technology...
High-end FPGA chips demand is mounting significantly for datacenter, 5G and AIoT applications, providing growth momentum for related wafer foundry, analysis and test players as well...
TSMC with its competitive 7nm process technology has obtained orders for made-for-AI chip processors from Nvidia, Xilinx and Qualcomm, and a number of China-based vendors such as...
Huawei has been ramping up orders for chips used in its 5G base station equipment, according to sources at backend houses, which expect the China-based player's chip demand to remain...
Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family to now include what the company claims is the world's largest FPGA, the Virtex UltraScale+ VU19P, with 35...
China chipmaker HiSilicon is reportedly to sign with Taiwan IC supply chain partners capacity guarantee agreements valid through the second quarter of 2020, despite uncertainties...
Backend house King Yuan Electronics (KYEC) reportedly will team up with Qualcomm to set up an engineering test center to be installed with 20-30 sets of equipment for testing 5G radio-frequency...
Leading FPGA chip maker Xilinx is aggressively moving to tap into the market for chip solutions for 5G base stations, and the move is expected to increase orders by 15% for Taiwan-based...
IC distributors WPG and WT Microelectronics both saw their December revenues register double-digit sequential decreases, but their revenues for all of 2018 still hit record-high le...
Heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for SiP...
With the AI and 5G markets set to flourish, chip demand for HPC, IoT and cloud servers is expected to enjoy substantial growth in 2019, according to sources at Taiwan-based IC dist...
At Intel Architecture Day 2018, top executives, architects and fellows revealed next-generation technologies and discussed progress on a strategy to power an expanding universe of...
Intel has hosted a forum for Internet of Things (IoT) products and technologies in Taiwan, attracting the participation of major IPC players including Advantech, Adlink Technology,...
Xilinx will mass roll out its next-generation 7nm FPGA chips in 2019, and TSMC and other Xilinx supply chain partners including Chunghwa Precision Test Tech (CHPT) and Answer Technology...
