According to Infineon's press release, the European Commission has approved funding for Infineon's Smart Power Fab in Dresden under the European Chips Act, with expected approval...
Reports indicate that the Trump administration is considering revising incentive agreements under the CHIPS and Science Act (commonly referred to as the 'CHIPS Act'), potentially...
The Trump administration has begun reviewing incentive agreements under the CHIPS and Science Act (hereinafter the CHIPS Act), signaling potential renegotiations and delays in upcoming...
Sam Altman's recent global tour across Japan, South Korea, and India highlights OpenAI's ambitious drive to establish strategic alliances throughout Asia. While SoftBank's Masayoshi...
Taiwan's government has set an ambitious target to expand its AI computing infrastructure to 480 Petaflops (PF) by 2029, with the potential to reach 1,200 PF through private sector...
Intelligent Epitaxy Technology (IntelliEPI) chairman Yung-Chung Kao said the Trump administration continues to push domestic semiconductor firms to expand capacity and R&D. The...
As the spring begins for 2025, China's IC industry has seen a major injection of funding. Wuxi SJ Semiconductor has closed a financing agreement worth roughly US$700 million. This...
Canada-based microLED startup VueReal has secured a US$40.5 million Series C funding round to expand its production capacity, strengthen its ecosystem, and scale up the manufacturing...
Honda is expanding its US investment with an additional US$300 million, aligning with President Donald Trump's policies and the growing demand for EVs in North America. This investment...
The Stargate project, a landmark US$500 billion joint venture announced by US President Donald Trump in early 2025, has exposed growing tensions between OpenAI and Microsoft. While...
Despite concerns over President-elect Trump's criticism of Taiwan's alleged semiconductor industry appropriation, TSMC's CFO Wendell Huang expressed confidence that the company will...
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards...
In recent years, the Japanese government has concentrated its semiconductor subsidy investments primarily on chip manufacturing. This includes financial support for TSMC to set up...
Prior reports indicated that Rapidus is on track to secure orders from Broadcom, with plans to deliver 2nm chip prototypes by June 2025.This positions Rapidus to successfully mass-produce...
