China plans to develop over 50 new national and industrial standards for the AI sector by 2026. These efforts are part of new guidelines aimed at standardizing systems within the...
Despite increasing numbers of graduates from electrical engineering, electronics, and optoelectronics programs trained by six universities joining the industry, Taiwan still faces...
The global AI surge has cast an unexpected spotlight on Taiwan's hardware industry. On July 1, the Project TAME (TAiwan Mixture of Experts) initiative was launched, aiming to establish...
Chinese tech companies are embracing a 'multi-chip hybrid' strategy to enhance their ultimate AI computing power. This approach supplements foreign offerings while avoiding sole reliance...
Thanks to the incentive policy for mobile phone manufacturing offered by the Indian government and a need to diversify production away from China, Apple suppliers reportedly met their...
The rise of Chinese Electric Vehicle (EV) brands has prompted their larger international counterparts to engage in a price war in China to defend their market share, according to...
BYD Co. sold a record number of electric and hybrid cars in the second quarter, sales data compiled by Bloomberg News shows, as price cuts and new technology stoked consumers into...
As the global supply chain undergoes restructuring, Malaysia and Singapore have emerged as attractive destinations for semiconductor companies seeking to establish manufacturing operations...
OpenAI recently surprised users by announcing that, starting July 9, 2024, it will cease providing API services to China and other regions, including Hong Kong.
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
Chinese EV giant BYD is making significant inroads into the South Korean and Japanese markets, challenging established domestic players and reshaping the competitive landscape in...
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...
