ChipMOS Technology has embraced a cautious approach to capital expenditures for 2025 and anticipates that the demand for display driver ICs will experience a more pronounced correction...

Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...