China announced sanctions against five US subsidiaries of South Korean shipbuilder Hanwha Ocean on October 14, 2025. The move comes on the eve of the Asia-Pacific Economic Cooperation...
LG Electronics is accelerating its deployment in the HBM equipment business after reportedly investing in hybrid bonding development. With Hanmi Semiconductor dominating the market...
South Korean defense giant Hanwha Aerospace is accelerating its push into autonomous warfare, unveiling a comprehensive plan to develop a new generation of AI-driven unmanned ground...
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to...
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment...
SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing...
In a milestone move signaling the transition of South Korea's space ambitions from government-led development to commercial enterprise, the Korea Aerospace Research Institute (KARI)...
Hyundai Motor Group Executive Chair Chung Eui-sun will visit Washington on July 30 to back South Korea's final-stage trade negotiations with the US, joining Samsung Chairman Lee Jae-yong...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
A high-stakes patent dispute between Hanwha Semitech and Hanmi Semiconductor over a critical piece of equipment in the HBM production process — the TCB machine — is set...
