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NEWS TAGGED HARDWARE INNOVATION CENTER
Tuesday 29 July 2008
Microsoft to set up third R&D center in Taiwan
Microsoft will establish a Hardware Innovation Center (HIC) in Taiwan, the third R&D center in Taiwan following the Microsoft Technology Center set up in June 2003 and Microsoft...
BIZ FOCUS
Feb 4, 08:00
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
Tuesday 3 February 2026
Asia FinTech Alliance (AFA) Announces Leadership Election Results
Monday 2 February 2026
Smiths Interconnect to Showcase Next-Generation Test Solutions at DesignCon 2026
Friday 30 January 2026
BIWIN Mini SSD Ecosystem Application Seminar Concluded Successfully
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Musk vows to build 2nm fab, claims industry got cleanroom wrong
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Trump nears Taiwan trade deal tied to massive US chip expansion
Insight: ASIC servers accelerate liquid cooling adoption, share set to surge in 2026
MediaTek warns of sharp smartphone revenue drop in early 2026 as cost pressures mount
China pulls the plug on EV door-handle futurism
India reportedly explores linking UPI with China-linked Alipay+ to expand cross-border digital payments
India advances semiconductor ambitions as TSMC fabricates DLI-backed startup chips
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RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
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