CONNECT WITH US
NEWS TAGGED HBM3
Friday 13 October 2023
Samsung set to roll out HBM4 in 2025 incorporating advanced packaging solution
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Tuesday 3 October 2023
Samsung, SK Hynix enhance memory packaging investments, eyeing explosive HBM demand to start in 2024
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Wednesday 6 September 2023
GUC announces 5nm HBM3 PHY and controller silicon proven at 8.4Gbps

Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on...

Wednesday 6 September 2023
SK Hynix reclaims no. 2 DRAM vendor spot with global market share exceeding 30% in 2Q23
As generative AI keeps driving demand for high bandwidth memory (HBM), the global DRAM market landscape is also undergoing changes, with SK Hynix's global DRAM market share exceeding...
Thursday 31 August 2023
South Korean equipment makers keen on developing new-gen HBM processing tools
The proliferating artificial intelligence (AI) applications are generating significant growth potential in demand for next-generation high bandwidth memory (HBM) chips, driving South...
Thursday 24 August 2023
AI server shipments forecast to top 300,000 units in 2024, says DIGITIMES Research
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...