The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...

SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...

Despite achieving record revenue in the third quarter of 2024, Samsung has reported a significant decline in its semiconductor operating profit, which fell by 40% compared to the...

SK Hynix delivered a record-breaking performance in the third quarter of 2024 with both revenue and operating profit reaching all-time highs, driven largely by its dominance in high...

SK Hynix will announce its financial results for the third quarter of 2024 on October 24. During its previous earnings call, the company indicated that shipments of its HBM3E products...

As Samsung Electronics (Samsung) faces delays in the mass production of HBM3E, the company is looking to enter Nvidia's supply chain through its competitive GDDR DRAM offerings. Recent...

Samsung Electronics' high-bandwidth memory (HBM) division, which has been struggling to regain competitiveness, is now glimpsing a potential revival. With AMD's latest AI accelerator...

Samsung Electronics has been unable to obtain Nvidia's certification for its fifth-generation high-bandwidth memory, the HBM3E, for almost a year. This has led to speculation about...

Samsung Electronics is encountering significant challenges, especially in its semiconductor business. Beyond stagnation in its foundry business, concerns about its competitiveness...

The DRAM equipment investment plans of Samsung Electronics (Samsung) and SK Hynix in 2025 may vary based on the sales of high bandwidth memory (HBM).

These are the most-read DIGITIMES Asia stories in the week of October 7 - October 13.

Samsung Electronics reported consolidated revenue of KRW79 trillion (about US$58.6 billion) and an operating profit of KRW9.1 trillion for the third quarter of 2024, missing market...

SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...

SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...

Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...