K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...

AMD will launch a new generation of MI325X chips utilizing HBM3E in October to enhance its standing in the AI GPU market, aiming to secure orders from AI server clients seeking to...

South Korean semiconductor giants Samsung Electronics and SK Hynix are facing a more cautious outlook for the third quarter of 2024 as demand for AI server chips surges. Recent downgrades...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and...

Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...

SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...

After Nvidia confirmed the on-schedule shipment of its latest Blackwell GPUs, high-bandwidth memory (HBM) providers, including SK Hynix and Samsung Electronics, expressed relief as...

China-based cloud service providers (CSP) have placed short lead-time orders for HBM memory with Samsung Electronics, purposely stockpiling HBM chip inventory ahead of time due to...

Tae-won Chey, CEO and chairman of SK, was quoted in recent South Korean media reports as addressing the market's growing fears about the AI bubble and the commercialization of sixth-generation...

Samsung Electronics has clarified to DIGITIMES that testing of its 5G high-bandwidth memory (HBM3E) is still ongoing, despite recent reports suggesting successful completion...

China is attempting to produce High-Bandwidth Memory (HBM) in hopes of regaining control over AI, according to South Korean industry insiders.

SK Hynix is set to showcase its latest advancements in its memory technologies and products at the upcoming Future Memory and Storage (FMS) 2024 event.

Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to...

AMD announced that its MI300 revenue reached US$1 billion in a single quarter.

Benefiting from its High Bandwidth Memory (HBM) business, SK Hynix has experienced substantial revenue growth and forecasts a doubling of shipments in 2024. Regarding recent concerns...