AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron...
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is...
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
Samsung Electronics, once known for showcasing its "super gap" or "ultra gap" in chipmaking prowess, has taken an uncharacteristically quiet approach to its 2025 foundry events. The...
Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's...
In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...
Samsung Electronics is doubling down on its leadership in advanced memory technology. Following its latest developments at the Pyeongtaek facility, industry sources report that Samsung...
US President Donald Trump's recent visit to the Middle East has emerged as a significant catalyst for the global AI industry, sparking new partnerships and investments aimed at addressing...
Nvidia CEO Jensen Huang made a special visit to the SK Hynix booth at Computex 2025, leaving messages of support and showing the close cooperative relationship between the two comp...
A brewing conflict between SK Hynix and its long-time supplier, Hanmi Semiconductor, over thermal compression bonder (TC Bonder; TCB) equipment has intensified, potentially reshuffling...
