Global memory leaders Samsung, SK Hynix, and ChangXin Memory Technologies (CXMT) are ramping up DRAM production this year, fueling market competition. While oversupply is expected...
At CES 2025, Nvidia CEO Jensen Huang publicly addressed challenges regarding Samsung Electronics' HBM3E memory design, marking his first explicit acknowledgment of the issues that...
Micron is aggressively expanding its footprint in the high-bandwidth memory market, capitalizing on surging AI chip demand to accelerate growth. Backing this expansion, the company...
As competition in the high bandwidth memory (HBM) market escalates, SK Hynix is on track to begin mass production of its 16-layer HBM3E products as planned. The significance of this...
As Broadcom strengthens its position in AI chip development through partnerships with industry giants like Apple and Google, the company has now secured a significant high-bandwidth...
Micron Technology reported record fiscal first-quarter revenue driven by data center SSD sales, which now represent over half of total revenue. While HBM shipments doubled quarter...
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden...
The South Korean government has assured that the Biden administration's latest semiconductor control measures against China, including restrictions on high bandwidth memory (HBM)...
Nvidia is currently conducting high bandwidth memory (HBM) verification tests with Samsung Electronics (Samsung), with industry attention focused on the validation timeline and potential...
During Nvidia's earnings call for the third quarter of fiscal year 2025, CEO Jensen Huang expressed gratitude to supply chain partners including TSMC and SK Hynix for their contribution...
With the acceleration of Blackwell mass manufacturing, the capacity of HBM3E will greatly grow. According to industry estimates, after a twofold rise in HBM production in 2024, demand...
The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Despite achieving record revenue in the third quarter of 2024, Samsung has reported a significant decline in its semiconductor operating profit, which fell by 40% compared to the...
SK Hynix delivered a record-breaking performance in the third quarter of 2024 with both revenue and operating profit reaching all-time highs, driven largely by its dominance in high...
