CONNECT WITH US
NEWS TAGGED HBM3E
Friday 11 April 2025
HBM helps SK Hynix claim crown as Samsung loses DRAM leadership
Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's...
Tuesday 8 April 2025
Samsung logs profit beat with boost from Galaxy smartphones
Samsung Electronics Co.'s quarterly profit beat expectations after strong demand for its Galaxy S25 smartphones and legacy DRAM outpaced slipping margins in the high-stakes AI memory...
Wednesday 2 April 2025
Hanmi Semiconductor hikes key HBM equipment price, likely impacts SK Hynix
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
Tuesday 1 April 2025
Samsung looks to salvage chip fortunes as chairman Lee Jae-yong courts China's AI and EV powerhouses
Samsung Electronics Chairman Lee Jae-yong recently made a high-profile visit to China, meeting with leading Chinese automaker executives and President Xi Jinping. South Korean analysts...
Friday 28 March 2025
SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
Friday 28 March 2025
Samsung and SK Hynix profits set to soar with memory chip market recovery
As the memory chip market re-enters a favorable cycle, industry forecasts predict that Samsung Electronics and SK Hynix's operating profits in 2025 could surge by 40% compared to...
Wednesday 26 March 2025
Micron breaks the 'memory wall' with Nvidia: SOCAMM, HBM3E now shipping
Micron Technology showcased its latest AI-optimized memory technologies at GTC 2025, unveiling advanced DRAM solutions designed for data center and high-performance computing (HPC)...
Monday 24 March 2025
SK Hynix to pull M15X fab timeline forward by two months
SK Hynix is reportedly accelerating equipment installation at its M15X fab in Cheongju, South Korea, moving the original timeline forward from December to October in response to surging...
Thursday 20 March 2025
Samsung's HBM3E reportedly receives high marks during Nvidia audit
Samsung Electronics' fifth-generation HBM3E received satisfactory scores during Nvidia's recent audit and is expected to pass Nvidia's quality certification as early as June, according...
Thursday 20 March 2025
Samsung vows to reclaim ground in AI memory market with rollout
Samsung Electronics Co. pledged to strengthen its position in the high-bandwidth memory (HBM) chip market this year, in response to shareholder criticism over its underperformance...
Thursday 20 March 2025
SK Hynix, Micron exhibit AI memory solutions at Nvidia GTC
At the ongoing Nvidia GTC 2025, both SK Hynix and Micron Technology have demonstrated their respective AI memory solutions.
Wednesday 19 March 2025
SK Hynix launches early 12-layer HBM4 samples, eyes H2 production
SK Hynix announced on March 19 that it has begun delivering early samples of its new 12-layer HBM4 ultra-high performance DRAM for AI applications to key clients.
Friday 14 March 2025
Global top-3 memory maker status, 4Q24

Introduction

Thursday 13 March 2025
Nvidia reportedly visits Samsung packaging plant amid HBM3E supply uncertainty
High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources...
Tuesday 4 March 2025
SK Hynix America sees revenues soar in 2024 amid high demand for advanced memory products
SK Hynix America, the US branch of SK Hynix, is seeing significant revenue growth due to the demand for HBM. In 2024, its revenue rose about 2.6 times from the previous year.