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NEWS TAGGED HBM3E
Thursday 11 December 2025
SK Hynix reaps largest benefits from H200 export approval
US President Donald Trump has allowed Nvidia's H200 chips to be exported to China, benefiting Samsung Electronics and SK Hynix. iNews24 and IT Chosun reported that...
Wednesday 10 December 2025
Nvidia H200 clearance paves the way for HBM3E in China
The Trump administration has authorized exports of Nvidia's H200 artificial intelligence processors to China, a decision that analysts view as a partial concession allowing restricted...
Monday 8 December 2025
SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans
SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...
Monday 8 December 2025
Samsung shifts focus from HBM to DDR5 modules for higher profits
Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around...
Friday 5 December 2025
Broadcom CEO visits South Korea as Samsung HBM4 reportedly obtains Google TPU certification
Update: Samsung has since reached out to DIGITIMES and denied this report. The company also declined to provide more details.
Tuesday 2 December 2025
Samsung, SK Hynix set profit-first DRAM regime
Samsung Electronics and SK Hynix, which control about 70% of the global DRAM market, signalled in recent IR meetings with global investment banks that they will not pursue aggressive...
Tuesday 2 December 2025
Samsung restructures research and memory teams to reclaim HBM market share
Samsung Electronics is undertaking one of its most significant internal restructurings in years as the company pushes to strengthen its artificial intelligence (AI) capabilities and...
Monday 1 December 2025
Samsung's HBM3E performance leap propels it to become primary supplier of Google's Ironwood TPU
Media reports show that Google's Ironwood TPU is equipped with HBM3E from Samsung Electronics and SK Hynix. According to the Korea Economic Daily, Samsung supplied over 60%...
Monday 1 December 2025
TSMC reportedly set to take over base-die production in HBM4E generation

Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E...

Friday 28 November 2025
Samsung races to seal HBM4 deal with Nvidia, targets early 2026 shipments
Samsung Electronics is reportedly nearing a deal with Nvidia on 2026 HBM4 pricing, aiming to match SK Hynix's rates as the company accelerates capacity expansion and reorganizes its...
Monday 24 November 2025
Micron denies redesign of HBM4, confirms 2026 launch with full bookings
Micron has rejected reports claiming it is redesigning its HBM4 product due to failure to meet Nvidia's data transfer requirements. The company stated that HBM4 will be launched as...
Monday 24 November 2025
VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout...

Sunday 9 November 2025
SK Hynix pushes 1C DRAM for HBM4E as AI memory demand surges
South Korea's two largest memory chipmakers, SK Hynix and Samsung Electronics, are reportedly finalizing supply agreements with Nvidia for next-generation high-bandwidth memory (HBM4),...
Thursday 6 November 2025
SK Hynix tight-lipped on Nvidia supply terms as HBM4 prices climb
SK Hynix has reportedly increased the price of its sixth-generation high-bandwidth memory (HBM4) supplied to Nvidia by over 50% compared to the previous generation HBM3E. Industry...
Tuesday 4 November 2025
Samsung and SK Hynix face capacity dilemma amid rising HBM profits and DDR5 demand
Driven by the corporate AI boom, demand for high-bandwidth memory (HBM) is expanding beyond its traditional niche into general-purpose memory. Prices for mainstream DRAM products...