Samsung Electronics and SK Hynix recently disclosed the orders and development of their High-Bandwidth Memory (HBM) products and have released optimistic comments for standard DRAM...
Samsung Electronics reportedly plans to dedicate separate development teams for next-generation High Bandwidth Memory (HBM) products, HBM3E and HBM4, to strengthen its competitiveness...
Samsung Electronics and SK Hynix are locked in fierce competition in the High-Bandwidth Memory (HBM) market, with attention turning to Nvidia, the leader in Artificial Intelligence...
SK Hynix recently held a press conference to unveil its development blueprint for HBM4, scheduled for mass production in 2025, a year ahead of the original plan, to maintain its technological...
Nvidia is arguably the biggest "beneficiary" of Artificial Intelligence (AI) so far, but the recent 10% plunge in Nvidia's stock price and the evaporation of its market capitalization...
As the AI boom gains momentum, the High Bandwidth Memory (HBM) sector emerges as a pivotal battleground, with three major memory chipmakers vying to reshape the industry landscape...
On April 19, SK Hynix announced that it had recently signed a memorandum of understanding (MOU) with TSMC. The two companies will collaborate closely on producing next-generation...
Primary memory manufacturers are expected to encounter increased competition in the High Bandwidth Memory (HBM) industry in the second half of 2024, as manufacturing technology specs...
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
