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    NEWS TAGGED HBM4
    Wednesday 20 August 2025
    Why TSMC's CoWoS bottleneck could lock AI memory makers into Nvidia's orbit
    The AI chip market is expected to stay under Nvidia's dominance in 2026, as Samsung Electronics, SK Hynix, and Micron battle to win sixth-generation high-bandwidth memory (HBM4) orders...
    Wednesday 20 August 2025
    Samsung's HBM3E supply to Nvidia loses strategic significance as focus shifts to HBM4 in 2026
    Driven by the booming demand for artificial intelligence (AI) servers, high-bandwidth memory (HBM) has become a key factor reshaping the memory industry landscape. Micron recently...
    Tuesday 19 August 2025
    Samsung to challenge SK Hynix, Micron in Nvidia HBM supply after delays

    Samsung Electronics is intensifying its bid to break into Nvidia's high-bandwidth memory (HBM) supply chain after lagging behind SK Hynix...

    Saturday 16 August 2025
    Nvidia reportedly confirms Rubin AI chip launch timeline as AMD reveals 2026 server challenge
    Nvidia, navigating a complex mix of geopolitics and growing competition, says its next-generation Rubin AI chip remains on schedule, despite rumors of delays and new US revenue-sharing...
    Wednesday 13 August 2025
    Samsung bets big on DRAM overhaul to reclaim HBM crown
    Samsung Electronics is doubling down on its bet to regain leadership in high-bandwidth memory (HBM), the ultra-fast chip architecture powering next-generation artificial intelligence...
    Thursday 7 August 2025
    Samsung denies HBM3E price-cut rumors amid Nvidia approval delay
    Samsung Electronics has secured an order from Tesla for artificial intelligence (AI) chips, offering a renewed boost to its foundry business. However, the company continues to face...
    Monday 4 August 2025
    Hanmi confident in securing all HBM4 equipment orders as half of 1H25 sales go to Taiwan
    Benefiting from the development of the high-bandwidth memory (HBM) market, Hanmi Semiconductor's second quarter 2025 performance continues to hit new highs, with overseas markets...
    Wednesday 30 July 2025
    Samsung accelerates Pyeongtaek P4 to boost 1c DRAM mass production
    Samsung Electronics is accelerating the resumption of construction at the fourth phase (PH4) of its Pyeongtaek Campus Line 4 (P4) in South Korea, where construction was halted last...
    Friday 25 July 2025
    SK Hynix accelerates investment for 2025 HBM boom as Samsung targets Nvidia certification in third quarter
    The surge in demand for high-bandwidth memory (HBM) driven by AI servers has positioned SK Hynix as the clear leader in the HBM market, with Micron also posting strong operational...
    Thursday 24 July 2025
    Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory

    Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling...

    Thursday 24 July 2025
    Samsung plans HBM4 comeback with advanced chip technology
    Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
    Wednesday 23 July 2025
    Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?
    Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
    Wednesday 23 July 2025
    Samsung bets on GAA and HBM4 to retake AI crown
    The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
    Tuesday 22 July 2025
    Inside Samsung's 1c DRAM breakthrough: How a design feud nearly derailed the project
    Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
    Monday 21 July 2025
    Samsung reportedly cracks 1c DRAM yield hurdle, positions HBM4 for AI rebound
    Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
    3/10 pages
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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