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NEWS TAGGED HBM4
Friday 27 March 2026
SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...
Monday 23 March 2026
SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
Monday 23 March 2026
At Cheonan, Samsung is rewriting HBM's bonding playbook
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
Sunday 22 March 2026
Samsung union votes to strike, risking Nvidia HBM4 supply disruption
Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to...
Friday 20 March 2026
Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
Friday 20 March 2026
Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting
Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM),...
Thursday 19 March 2026
AMD, Samsung deepen AI chip ties with HBM4 supply and foundry talks

AMD CEO Lisa Su met Samsung Chairman Lee Jae-yong on March 18, the same day the two companies signed a memorandum of understanding (MOU)...

Thursday 19 March 2026
Samsung, AMD expand AI memory and compute partnership with MOU to align HBM4 supply and DDR5 support
Samsung Electronics announced it signed a Memorandum of Understanding with AMD to expand its strategic collaboration on next-generation AI memory and computing technologies.
Thursday 19 March 2026
SK Hynix presses ahead on HBM4 despite tightening AI memory supply
SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven...
Wednesday 18 March 2026
AMD's Lisa Su courts Korea: Samsung HBM4 sealed, Naver next
AMD CEO Lisa Su broadened the company's collaboration with Samsung Electronics on next-generation artificial intelligence (AI) memory and met with regional partners, including Naver,...
Tuesday 17 March 2026
HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
The 2026 NVIDIA Global Technology Conference (GTC) has transcended its origins as a developer forum to become the ultimate proving ground for the high-bandwidth memory (HBM) indust...
Tuesday 17 March 2026
Micron enters high-volume production of HBM4 and PCIe Gen6 SSDs for Nvidia platforms
At the Nvidia GTC 2026 conference, Micron Technology signaled a major push in the AI hardware race, announcing high-volume production of memory and storage components purpose-built...
Tuesday 17 March 2026
Nvidia GTC 2026: Samsung unveils HBM4E, showcasing comprehensive AI solutions, Nvidia partnership, and vision
Samsung Electronics outlined the full range of AI computing technologies it will present at Nvidia GTC 2026 in San Jose, California, March 16-19, highlighting memory, logic, foundry,...
Tuesday 17 March 2026
SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California.