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    NEWS TAGGED HBM4
    Thursday 7 August 2025
    Samsung denies HBM3E price-cut rumors amid Nvidia approval delay
    Samsung Electronics has secured an order from Tesla for artificial intelligence (AI) chips, offering a renewed boost to its foundry business. However, the company continues to face...
    Monday 4 August 2025
    Hanmi confident in securing all HBM4 equipment orders as half of 1H25 sales go to Taiwan
    Benefiting from the development of the high-bandwidth memory (HBM) market, Hanmi Semiconductor's second quarter 2025 performance continues to hit new highs, with overseas markets...
    Wednesday 30 July 2025
    Samsung accelerates Pyeongtaek P4 to boost 1c DRAM mass production
    Samsung Electronics is accelerating the resumption of construction at the fourth phase (PH4) of its Pyeongtaek Campus Line 4 (P4) in South Korea, where construction was halted last...
    Friday 25 July 2025
    SK Hynix accelerates investment for 2025 HBM boom as Samsung targets Nvidia certification in third quarter
    The surge in demand for high-bandwidth memory (HBM) driven by AI servers has positioned SK Hynix as the clear leader in the HBM market, with Micron also posting strong operational...
    Thursday 24 July 2025
    Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory

    Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling...

    Thursday 24 July 2025
    Samsung plans HBM4 comeback with advanced chip technology
    Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
    Wednesday 23 July 2025
    Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?
    Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
    Wednesday 23 July 2025
    Samsung bets on GAA and HBM4 to retake AI crown
    The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
    Tuesday 22 July 2025
    Inside Samsung's 1c DRAM breakthrough: How a design feud nearly derailed the project
    Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
    Monday 21 July 2025
    Samsung reportedly cracks 1c DRAM yield hurdle, positions HBM4 for AI rebound
    Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
    Monday 21 July 2025
    Amazon, Google drive HBM memory boom as custom AI chips threaten Nvidia’s lead
    As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
    Friday 18 July 2025
    SK Hynix may lose HBM crown by 2026 as rivals trigger price showdown
    Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually...
    Wednesday 16 July 2025
    Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
    Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
    Monday 14 July 2025
    Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

    As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

    Wednesday 9 July 2025
    Hanmi's HBM4 tools go live, but is 2029 too late for hybrid bonding?
    Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
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    Research Report Database
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 9 July 2025
    How distribution is evolving in 2025
    Wednesday 9 July 2025
    AI apprentice available online; Profet AI facilitates manufacturing transformation and resolves industry challenges
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES