SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather...
SK Hynix's third quarter suggests that, for now, the memory industry's familiar boom-and-bust pattern is giving way to something closer to a contracted, supply-constrained business...
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26,...
Samsung Electronics is expected to enter 2027 with approximately 80% of its planned memory production secured under long-term contracts, reinforcing its pricing position while China's...
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up...
Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited...
Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale...
Memory supply and demand will tighten further in 2027. According to supply chain sources, South Korean memory makers have recently quoted aggressive long-term contract prices for sixth-generation...
Samsung Electronics is reportedly seeking 2027 prices for its next-generation high-bandwidth memory (HBM) that are more than three times the price of its current HBM3E product, industry...
Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
