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    Shortage beyond memory: CPU shortages worsen PC supply chain woes, Intel 18a yield becomes new hope
    10h 37min ago
    Foxconn's AI-driven US factory shifts from simulation to operation with new methodology
    10h 38min ago
    Chinese EV makers shift from Nvidia with Nio's in-house chips surpassing 550,000 units shipped
    10h 38min ago
    Tesla's AI5 chip uses SK Hynix LPDDR, Samsung to manufacture in 2027
    10h 38min ago
    Samsung's HBM4 yield improves, 4nm PMBIST upgrade receive praise from Nvidia
    10h 38min ago
    Analysis: ASML raised 2026 outlook amid surging EUV demand from SK Hynix and Samsung
    10h 38min ago
    NEWS TAGGED HBM4
    Thursday 16 April 2026
    Samsung pushes HBM4 yields as advanced testing and cutting technologies emerge
    Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According...
    Thursday 16 April 2026
    Samsung targets May HBM4E samples for Nvidia after validation

    Samsung Electronics is aiming to produce its first samples of next-generation high-bandwidth memory (HBM4E) as early as May, with plans...

    Wednesday 15 April 2026
    SK Hynix may cut Nvidia HBM4 shipments as Rubin ramp reportedly faces delays

    SK Hynix is reportedly considering reducing its planned 2026 shipments of high-bandwidth memory (HBM4) to Nvidia by about 20-30%, amid...

    Tuesday 14 April 2026
    Samsung begins P4 equipment orders as 1c DRAM investment enters execution

    Samsung Electronics has begun procuring semiconductor equipment for its P4 facility in Pyeongtaek, marking the transition of its planned...

    Tuesday 14 April 2026
    DDR5 dethrones HBM as memory's top profit engine
    The AI boom has reshuffled memory industry priorities. DDR5 modules have overtaken high-bandwidth memory (HBM) as the primary profit source for manufacturers — a reversal few...
    Thursday 9 April 2026
    Samsung P4 fab nears completion, expanding 1c DRAM capacity
    Samsung has entered the final phase of equipment investment at its P4 fab in Pyeongtaek, issuing purchase orders (POs) for front-end tools for Phase 2 (Ph2) and Phase 4 (Ph4). According...
    Tuesday 7 April 2026
    Samsung's eightfold profit jump signals AI spending immunity to geopolitical risk
    Samsung Electronics reported a record-shattering eight-fold leap in quarterly profit, as insatiable demand for artificial intelligence (AI) memory chips outweighed growing concerns...
    Monday 30 March 2026
    Weekly news roundup: AI, supply chains, new entrants intensify global chip race
    Below are the most-read DIGITIMES Asia stories from the week of March 23-27, 2026:
    Sunday 29 March 2026
    AMD, Meta reportedly audit Samsung HBM4 lines as supply shifts from pledges to validation

    Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to...

    Friday 27 March 2026
    SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

    SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

    Thursday 26 March 2026
    SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
    SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...
    Monday 23 March 2026
    SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
    SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
    Monday 23 March 2026
    At Cheonan, Samsung is rewriting HBM's bonding playbook
    Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
    Sunday 22 March 2026
    Samsung union votes to strike, risking Nvidia HBM4 supply disruption
    Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to...
    Friday 20 March 2026
    Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
    Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook