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    NEWS TAGGED HBM4
    Monday 30 March 2026
    Weekly news roundup: AI, supply chains, new entrants intensify global chip race
    Below are the most-read DIGITIMES Asia stories from the week of March 23-27, 2026:
    Sunday 29 March 2026
    AMD, Meta reportedly audit Samsung HBM4 lines as supply shifts from pledges to validation

    Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to...

    Friday 27 March 2026
    SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

    SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

    Thursday 26 March 2026
    SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
    SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...
    Monday 23 March 2026
    SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
    SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
    Monday 23 March 2026
    At Cheonan, Samsung is rewriting HBM's bonding playbook
    Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
    Sunday 22 March 2026
    Samsung union votes to strike, risking Nvidia HBM4 supply disruption
    Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to...
    Friday 20 March 2026
    Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
    Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
    Friday 20 March 2026
    Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting
    Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM),...
    Thursday 19 March 2026
    AMD, Samsung deepen AI chip ties with HBM4 supply and foundry talks

    AMD CEO Lisa Su met Samsung Chairman Lee Jae-yong on March 18, the same day the two companies signed a memorandum of understanding (MOU)...

    Thursday 19 March 2026
    Samsung, AMD expand AI memory and compute partnership with MOU to align HBM4 supply and DDR5 support
    Samsung Electronics announced it signed a Memorandum of Understanding with AMD to expand its strategic collaboration on next-generation AI memory and computing technologies.
    Thursday 19 March 2026
    SK Hynix presses ahead on HBM4 despite tightening AI memory supply
    SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven...
    Wednesday 18 March 2026
    AMD's Lisa Su courts Korea: Samsung HBM4 sealed, Naver next
    AMD CEO Lisa Su broadened the company's collaboration with Samsung Electronics on next-generation artificial intelligence (AI) memory and met with regional partners, including Naver,...
    Tuesday 17 March 2026
    HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
    The 2026 NVIDIA Global Technology Conference (GTC) has transcended its origins as a developer forum to become the ultimate proving ground for the high-bandwidth memory (HBM) indust...
    Tuesday 17 March 2026
    Micron enters high-volume production of HBM4 and PCIe Gen6 SSDs for Nvidia platforms
    At the Nvidia GTC 2026 conference, Micron Technology signaled a major push in the AI hardware race, announcing high-volume production of memory and storage components purpose-built...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook