News tagged HBM4 at DIGITIMES

NEWS TAGGED HBM4

Friday 12 December 2025

Samsung reportedly accelerates Pyeongtaek expansion to ramp up HBM4 and 1c DRAM production

Samsung Electronics is reportedly accelerating construction at its Pyeongtaek semiconductor complex to expand production of next-generation...

Tuesday 9 December 2025

Samsung moves up Pyeongtaek Phase 4 timeline in aggressive HBM4 push

Samsung Electronics, fresh off completing sixth-generation HBM4 development, is reportedly accelerating DRAM capacity expansion in a renewed effort to reclaim leadership in AI memo...

Tuesday 9 December 2025

Samsung's HBM4 edge fuels foundry recovery

Samsung Electronics, with its sixth-generation high-bandwidth memory (HBM4), uses base dies produced by Samsung Foundry. As Samsung's HBM4 competitiveness rises, the market expects...

Monday 8 December 2025

SK Hynix restructures global operations amid reported HBM4 production delay

SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic...

Monday 8 December 2025

SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans

SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...

Monday 8 December 2025

Weekly news roundup:Intel hires TSMC veteran, Samsung reportedly wins TPU HBM4 order

These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.

Monday 8 December 2025

Samsung shifts focus from HBM to DDR5 modules for higher profits

Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around...

Friday 5 December 2025

Broadcom CEO visits South Korea as Samsung HBM4 reportedly obtains Google TPU certification

Update: Samsung has since reached out to DIGITIMES and denied this report. The company also declined to provide more details.

Wednesday 3 December 2025

Samsung sixth-gen HBM reportedly cleared for production readiness, targets Nvidia supply chain

Samsung Electronics has reportedly completed the Production Readiness Approval (PRA) for its sixth-generation high-bandwidth memory (HBM), officially entering the production preparation...

Tuesday 2 December 2025

Samsung, SK Hynix lead HBM market, capitalize on Google's TPU push

Google's expanding investment in custom AI accelerators is reshaping the high-bandwidth memory market and lifting Samsung Electronics and SK Hynix as demand for tensor processing...

Tuesday 2 December 2025

AI drives Samsung's 2026 operating profit toward KRW100T

Artificial intelligence (AI) is fueling a DRAM supercycle, prompting South Korean securities firms to continuously raise their forecasts for Samsung Electronics' operating profit...

Tuesday 2 December 2025

Samsung restructures research and memory teams to reclaim HBM market share

Samsung Electronics is undertaking one of its most significant internal restructurings in years as the company pushes to strengthen its artificial intelligence (AI) capabilities and...

Monday 1 December 2025

Samsung and SK Hynix to unveil next-gen memory tech at ISSCC 2026

At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance...

Monday 1 December 2025

Samsung's HBM3E performance leap propels it to become primary supplier of Google's Ironwood TPU

Media reports show that Google's Ironwood TPU is equipped with HBM3E from Samsung Electronics and SK Hynix. According to the Korea Economic Daily, Samsung supplied over 60%...

Monday 1 December 2025

TSMC reportedly set to take over base-die production in HBM4E generation

Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E...

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