News tagged HBM4 at DIGITIMES

NEWS TAGGED HBM4

Tuesday 28 July 2026

SK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise...

Monday 27 July 2026

Samsung converts AMD and OpenAI ties into HBM4 supply wins

Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships...

Monday 27 July 2026

Samsung to use 2nm process for HBM5 base die as heat challenge grows

Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

Friday 24 July 2026

AMD splits next-generation data center GPUs for specialized AI demand

AMD unveiled its Instinct MI400 series at its Advancing AI 2026 conference, broadening its push into data center chips with products aimed at different users. For global readers, the...

Wednesday 22 July 2026

Nvidia's Huang to meet Samsung, SK and Naver chiefs in Silicon Valley, reports say

Samsung Electronics executive chairman Lee Jae-yong, SK Group chairman Chey Tae-won and Naver founder and board chairman Lee Hae-jin are reportedly preparing to meet Nvidia CEO Jensen...

Tuesday 21 July 2026

Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

Tuesday 21 July 2026

Samsung could overtake SK Hynix in the HBM market by 2027

Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money...

Monday 20 July 2026

HBM4 battle shifts to cooling as hybrid bonding slips

Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...

Thursday 16 July 2026

Hanmi, Hanwha clash in court over HBM equipment patents

Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...

Wednesday 15 July 2026

Samsung has yet to receive HBM4 volume-production order from Nvidia, dealsite reports

Samsung Electronics has yet to receive a volume-production order from Nvidia for HBM4 chips, with its HBM revenue from the AI chipmaker so far limited to paid evaluation samples, Dealsite...

Monday 13 July 2026

SK Hynix reportedly starts Nvidia HBM4 shipments ahead of September ramp

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Monday 13 July 2026

SK Hynix hybrid bonding push signals next phase of HBM packaging race

SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...

Friday 10 July 2026

Insight: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Friday 10 July 2026

Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026

HBM prices set to double in 2027 as AI demand and supply deals tighten the memory market

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

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