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NEWS TAGGED HBM4
Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
Tuesday 25 August 2026
Nvidia memory demand widens the gap between SK Hynix and Samsung

Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

Monday 24 August 2026
SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
Tuesday 18 August 2026
Samsung faces tougher HBM4E test after HBM4 comeback

Samsung Electronics' semiconductor chief has told executives not to treat the company's HBM4 comeback as proof that its recovery is...

Sunday 16 August 2026
Samsung, SK Hynix HBM4 hiring war drains South Korea's chip design talent
South Korea's semiconductor talent shortage is intensifying as Samsung Electronics and SK Hynix recruit experienced chip designers for increasingly complex HBM4 products, drawing key...
Thursday 13 August 2026
Hanmi pulls ahead of Hanwha as HBM4 orders rebound

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Wednesday 12 August 2026
Samsung HBM4 yield nears 80% in push to rival SK Hynix

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a...

Tuesday 11 August 2026
Memory drives 62% of Nvidia Vera Rubin's cost — SOCAMM2, not HBM4, leads the bill

Memory chips account for roughly 62% of the cost of Nvidia's next-generation AI platform, Vera Rubin, according to a new cost breakdown...

Monday 10 August 2026
Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Friday 7 August 2026
Nvidia tests leaner Rubin Ultra memory designs with 2027 HBM supply in question
Nvidia is testing sharply lower-memory versions of its next-generation Rubin Ultra GPU, a sign that the worsening high-bandwidth memory (HBM) shortage is beginning to reshape the specifications...
Thursday 6 August 2026
Samsung pitches 5nm as HBM4, Nvidia orders push 4nm lines to full capacity
Samsung Electronics' foundry arm is stepping up sales of its 5nm process as its more advanced 4nm capacity is expected to remain fully booked through 2027, driven by HBM4 base-die...
Tuesday 4 August 2026
Samsung Foundry nears full utilization, but 2nm yields remain a hurdle
Samsung Electronics' contract chipmaking business could approach full utilization in the second half of 2026, marking a potential turning point after prolonged underuse weighed on...
Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...