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NEWS TAGGED HBM4
Thursday 25 June 2026
Samsung chairman reviews HBM4 supply as revenue tops US$1 billion

Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...

Wednesday 24 June 2026
SK Hynix reportedly eases HBM4 push as commodity DRAM margins surge

SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a...

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on s...
Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.

Tuesday 16 June 2026
SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market....
Monday 15 June 2026
South Korea's chip equipment players ride the HBM4 wave

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics...

Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

Tuesday 9 June 2026
Samsung foundry profit rebound may come in 3Q26 as 2nm orders rise 130%
Samsung Electronics' foundry business may return to profit as early as the third quarter of 2026, ahead of its previous target of late 2026 to 2027, as improving yields, larger orders,...
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...
Tuesday 9 June 2026
Nvidia-SK Hynix pact sharpens memory race with Samsung, Micron
Nvidia's multiyear technology partnership with SK Hynix could reinforce the South Korean chipmaker's role in the AI memory supply chain, raising pressure on Samsung Electronics and...
Tuesday 9 June 2026
Samsung is already shipping HBM4 for Vera Rubin — and is now negotiating HBM5 and next-gen foundry with Nvidia
Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue...
Friday 5 June 2026
Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows
Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and...
Thursday 4 June 2026
HBM4 supply in focus as SK's Chey meets TSMC's Wei
SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom...
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...