News tagged HBM4 at DIGITIMES

NEWS TAGGED HBM4

Friday 13 June 2025

AMD confirms Samsung, Micron memory in MI350 chips in bid to break Nvidia's grip on AI

AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron...

Friday 13 June 2025

Micron ships HBM4 to key customers, targets solid market share in 2025

As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron...

Friday 13 June 2025

Micron reportedly clinches SOCAMM lead with Nvidia's greenlight

Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...

Friday 13 June 2025

Samsung, SK Hynix redo strategies ahead of HBM4 mass production, says report

As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...

Thursday 12 June 2025

Samsung reportedly fails third Nvidia HBM3E test; eyes re-certification in September

Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...

Wednesday 11 June 2025

Micron ships HBM4 samples to key customers, targets 2026 ramp up

According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is...

Tuesday 10 June 2025

Samsung likely to rely on HBM4 as UBS reports delay in 12-layer HBM3E certification

European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...

Wednesday 4 June 2025

Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun

Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is...

Wednesday 28 May 2025

Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles

In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...

Friday 23 May 2025

Samsung launches Dual-Site 1c DRAM expansion to bolster HBM4 leadership

Samsung Electronics is doubling down on its leadership in advanced memory technology. Following its latest developments at the Pyeongtaek facility, industry sources report that Samsung...

Thursday 22 May 2025

Nvidia CEO shows support for SK Hynix, praises 'beautiful' HBM4 at Computex 2025

Nvidia CEO Jensen Huang made a special visit to the SK Hynix booth at Computex 2025, leaving messages of support and showing the close cooperative relationship between the two comp...

Wednesday 30 April 2025

Samsung reportedly exits HBM2E under Chinese price offensive, shifts focus to high-end market

Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on...

Friday 25 April 2025

JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war

JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...

Monday 21 April 2025

Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with...

Monday 21 April 2025

Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

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