CONNECT WITH US
NEWS TAGGED HEAT DISSIPATION
Wednesday 20 November 2024
Liquid cooling for servers set to take off: 4 main challenges ahead
The era of liquid cooling for servers is on the horizon, but significant challenges remain. DIGITIMES Research analyst Kaylee Chiu outlines four critical hurdles liquid cooling technology...
Wednesday 30 October 2024
Server ODMs focus on leak-proof liquid cooling solutions, says DIGITIMES Research
DIGITIMES Research believes that liquid cooling technology is transforming the server cooling supply chain ecosystem. Various industry players are actively positioning themselves...
Friday 18 October 2024
High-spec power supplies for AI computing to drive growth for Liteon
As power management and heat dissipation become increasingly important with the high-performance computing required for generative AI, a trend is emerging in the field of power supplies:...
Wednesday 9 October 2024
Chairman Young Liu: AI will redefine Foxconn's manufacturing capabilities
In his opening speech at Hon Hai Tech Day (HHTD) on October 8, Chairman Young Liu stated that AI has become part of everyday life, and Foxconn's manufacturing capabilities are being...
Tuesday 1 October 2024
Status of liquid cooling solutions for AI servers

Introduction

Wednesday 18 September 2024
Heraeus Electronics eyes crucial thermal management solutions as AI chip performance advances
Thermal management has become an increasingly critical issue as the computing performance of AI chips continues to advance. High temperatures not only lead to slower performance due...
Friday 6 September 2024
Power consumption is main issue for AI development, says SK Hynix president Justin Kim
SEMICON Taiwan 2024 made its grand debut on the 4th. President of SK Hynix, Justin Kim, was invited to Taiwan and gave a keynote speech. He mentioned that to push AI technology towards...
Friday 6 September 2024
WinWay sees co-packaged optics ready for mass production by 2026
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Thursday 15 August 2024
Topco eyes AI-driven growth for silicone thermal solutions in 2H24
As the consumer electronics market enters its traditional peak season in the latter half of 2024, Taiwan's specialty chemical materials distributor, Topco Technologies Corp, is optimistic...
Friday 9 August 2024
I-Chiun targets AI server market with advanced heat spreaders, expects orders to double by 2H25
Taiwan-based I-Chiun Precision Industry has entered the AI supply chain with heat spreaders and is poised to ramp up shipments of new heat dissipation solutions in the second half...
Wednesday 17 July 2024
Tight supply of UQDs becomes bottleneck for AI server liquid cooling
The supply of Universal Quick Disconnects (UQD) for liquid cooling solutions has become tight, which may become the main bottleneck for AI server liquid cooling growth, according...
Monday 1 July 2024
Taisol sees increasing trend in use of liquid cooling
Liquid cooling is widely used in newly built data centers, and L2L (liquid to liquid) architecture has been widely adopted, according to Taiwan-based cooling module maker Taisol El...
Thursday 20 June 2024
LX Semicon's new CEO to shift focus to thermal substrate market over SiCs
South Korea's leading IC design company, LX Semicon, is reportedly downsizing its Silicon Carbide (SiC) semiconductor R&D operations.
Thursday 6 June 2024
Taiwan's GenAI ecosystem unrivaled for next decade, says former tech minister
Taiwan boasts a comprehensive Generative AI (GenAI) ecosystem, with deep deployments in AI chips, packaging, and heat dissipation technologies, and no other place in the world is...
Thursday 6 June 2024
LG Electronics cracks US data center cooling market amid AI boom
As the AI boom fuels a surge in US data center investments, the demand for efficient cooling systems is becoming increasingly critical. LG Electronics, seizing the opportunity, has...