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Wednesday 19 July 2023
RAMP-C program on Intel 18A adds 2 strategic defense industrial base customers
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Friday 14 July 2023
With protectionism intensifying in China, how should Taiwan's semiconductor supply chain respond?
Amid the ongoing US-China trade war, Chinese communication system giants such as Huawei and ZTE have taken a low-key approach on the international stage, but back in their home country,...
Wednesday 5 July 2023
Ultra-high-density heterogeneous integration tech sees breakthrough under Taiwan-US academic collaboration
A breakthrough in ultra-high density heterogeneous integration has been achieved through an academic collaboration between Taiwan and the US as part of a research project under the...
Monday 3 July 2023
Silicon Island Chronicles series interview: Etron CEO Nicky Lu on heterogeneous integration of chips (1)
Nicky Lu, founder and CEO of Etron Technology, pioneered the concept of "heterogeneous integration" and further developed the theory of monolithic & heterogeneous integration...
Thursday 15 June 2023
3D DRAM to see clear development direction in next 2-3 years
Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former...
Monday 12 June 2023
Taiwan academia gearing up to help TSMC maintain leading edges
In helping TSMC maintain its leading edge, the government has approved funding support for a spate of R&D projects undertaken by academic research teams, aiming to fill related...
Monday 22 May 2023
ASE lands Broadcom orders for silicon photonics-based networking chips
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Wednesday 17 May 2023
Etron rolls out SPU chip built using TSMC 28nm process
Etron Technology has rolled out its new-generation stream processor unit (SPU) built using TSMC's 28nm process.
Friday 21 April 2023
eMemory security-enhanced OTP qualifies on TSMC N5
NeoFuse, a security-enhanced version of eMemory's one-time programmable (OTP) non-volatile memory (NVM) technology, has been qualified on the TSMC N5 process. Another design tape-out...
Thursday 6 April 2023
JCET reports record revenue, profit for 2022
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...
Thursday 3 November 2022
SEMICON China Forum: Find ways out under US trade ban
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
Tuesday 25 October 2022
Chiplet mass adoption easier said than done
As the semiconductor industry once again frets over the future of Moore's Law, the notion of chiplets has gained traction, especially as the technology has come to be prominently...
Wednesday 5 October 2022
Equipment supply and demand gap stabilizing for OSATs, IDMs: Q&A with K&S SVP Chan Pin Chong
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Thursday 15 September 2022
IC test interface solutions providers see promising HPC demand
Taiwan IC test interface solutions providers continue to embrace robust demand from major US HPC processor vendors Intel, Nvidia and AMD, which will effectively offset reductions...