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Tuesday 28 December 2021
Heterogeneous integration, compound semi in spotlight at SEMICON Taiwan 2021
SEMICON Taiwan 2021 has kicked off in Taipei running from December 28-30, with this year's theme focusing on heterogeneous integration, compound semiconductors and other chipmaking...
Monday 20 December 2021
Apple reportedly moves to develop own RF chips
Apple is reportedly hiring talent to develop RF solutions, modem chips and other wireless semiconductors in house, sparking market concerns about possible impacts on its suppliers...
Wednesday 15 December 2021
Etron with in-house developed KOOLDRAM enters car industry supply chain
Etron Technology's in-house developed KOOLDRAM products are being adopted by car vendors, a milestone for its entry into the automotive sector, according to the Taiwan-based niche-market...
Tuesday 7 December 2021
Taiwan semiconductor players brace for GaN RF demand boom
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Wednesday 1 December 2021
TSMC advanced packaging enters next phase of development, says company VP
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
Thursday 4 November 2021
CHPT posts revenue gains for October, optimistic about 4Q21, 2022
Rising demand for 5G handset application processors, RF chips and HPC solutions boosted revenue at IC test solutions provider Chunghwa Precision Test Tech (CHPT) in October 2021,...
Tuesday 2 November 2021
Harvatek steps into heterogeneous integration packaging with YoungTek Electronics
LED packaging service provider Harvatek has stepped into heterogeneous integration packaging and packaging of LED devices integrated with ICs, through cooperation with IC testing...
Friday 29 October 2021
IC backend quotes to stay favorable to OSATs in 2022, says ASE
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
Thursday 16 September 2021
Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Monday 13 September 2021
China Big Fund stepping up investment in homegrown memory sector
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...
Tuesday 31 August 2021
TSMC launches advanced packaging for silicon photonics applications
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Thursday 17 December 2020
ASE to set up more smart factories in 2021
ASE Group will complete the establishment of its 18th smart factory by the end of this year, with plans to build seven more intelligent plants in 2021, according to company COO Tien...
Tuesday 24 November 2020
The 'curse' of chip scaling
Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to...
Thursday 5 November 2020
The evolution of heterogeneous integration enables the coming AI era
The era of AI is coming. It will not be long before our cities operate efficiently with tremendous amounts of devices and robots connected through 5G infrastructure with enough bandwidth...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research