Amid ongoing memory shortages and widespread component price hikes, research firms and major industry players have confirmed that PC shipments will fall in 2026 compared to 2025. Recent...
Taiwan's Industrial Technology Research Institute (ITRI) recently showcased 12 advanced machine tool key technologies driven by artificial intelligence (AI) at the 2026 Taiwan International...
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
Imaging technologies are expanding beyond time-lapse photography and consumer applications into higher-barrier military uses as the industry repositions in the post-pandemic era.
Memory module maker Team Group reported a record-high monthly profit for January 2026, with earnings soaring over 50 times year-over-year. Although shipments declined in February due...
As geopolitical tensions and energy transport risks heighten volatility in the global semiconductor supply chain, the stability of upstream critical materials — particularly...
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural...
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first...
Printed circuit board (PCB) giant Zhen Ding Technology recently held an earnings call where company chairman Charles Shen noted that customer demand across artificial intelligence...
Surging demand for unmanned vehicles is driving renewed interest in lightweight materials, as endurance limitations remain a key obstacle to large-scale commercialization. The trend...
China's advanced materials sector has made new strides. China National Building Material Group (CNBM) unveiled a domestically developed T1200-grade ultra-high-strength carbon fiber...
The Taiwan Printed Circuit Board Association (TPCA) held its annual member meeting, where chairman Lawrence Chang announced projections for the industry through 2026. The announcement...
Clevo reported a high-end pivot in its notebook business, selling 1.39 million units and posting notebook revenue of NT$17.4 billion (approx. US$546 million) in 2025, with consolidated...
Managing director Yao-Kuo Yu of Nichidenbo, a passive component distributor, stated that the AI industry's growing demand for passive components continues to tighten supplies of high-end...