Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on...

Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering...

While market focus surrounding AI infrastructure has centered primarily on core computing components—such as GPUs, CPUs, high-bandwidth...

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Apple has changed its iPhone launch cadence this year, splitting its high-end releases into two waves. The iPhone 18 Pro series went...

HEC Compucase's AI server-related rollout continues to gain traction as AI racks, cooling modules, and high-end power supplies move...

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...