News tagged high-end at DIGITIMES

NEWS TAGGED HIGH-END

Friday 2 October 2026

Global annual AI server shipments, 2025-2026

Introduction

Friday 2 October 2026

Amazon weighs US$8B chip sale-leaseback to support credit rating

Amazon is considering moving about US$8 billion worth of high-end Nvidia chips off its balance sheet through a sale-leaseback structure, according to the Financial Times and...

Friday 2 October 2026

JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities

JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...

Thursday 1 October 2026

Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity

Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction...

Thursday 1 October 2026

ASIC shipments top GPUs in 2027 as ABF substrate bottlenecks shift

The high-end cloud AI accelerator market will see a structural shift in 2027, with total ASIC shipments surpassing GPU shipments for the first time, driven by rising output from Google,...

Wednesday 30 September 2026

Gold Circuit turns Amazon into a shareholder for Trainium servers

Gold Circuit Electronics (GCE) plans to bring in Amazon as a strategic investor through a private placement expected to raise NT$1.59 billion (US$49.88 million), lifting the two companies...

Wednesday 30 September 2026

Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant

Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...

Wednesday 30 September 2026

AI boom strains PCB supply chain as materials, equipment shortages persist into 2027

Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...

Wednesday 30 September 2026

Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs

Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at...

Tuesday 29 September 2026

AI boom sends China and Taiwan's PCB makers racing to HK for capital

Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed...

Tuesday 29 September 2026

Taiwan PCB output hits record high on AI demand, putting NT$1 trillion year within reach

AI server, high-speed networking, and memory demand continued to lift Taiwan's PCB industry in the second quarter of 2026, boosting...

Thursday 24 September 2026

IEI sees network security, video growth through 2028

Industrial PC maker IEI Integration said on September 23 that it remains upbeat on full-year 2026 revenue, expecting double-digit growth...

Wednesday 23 September 2026

Vivo launches camera monitor accessory, stoking panel demand

Vivo officially unveiled its new flagship X500 series smartphones in Shanghai on September 21, along with wearable accessories including smartwatches and earphones. The X500 series...

Wednesday 23 September 2026

ZDT prices US$800M ECB to expand AI server PCB push

Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on...

Tuesday 22 September 2026

AT&S Unveils Strategy to Drive AI Growth

Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering...

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Oct 2, 08:00

Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'

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