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    Exclusive: Fuel vehicle SDV computing power hits physical limits due to cooling constraints
    Jan 12, 19:54
    Exclusive: Modular design faces bandwidth bottleneck in SDVs
    Jan 12, 19:54
    Taiwan's panel leaders poised for transformation with diversified revenue streams
    Jan 12, 19:54
    Memory chip shortage driven by AI infrastructure to raise device prices in 2026
    Jan 12, 19:54
    Rising silver, copper, and tin prices pressure passive component cost despite price hikes
    Jan 12, 19:54
    NEWS TAGGED HIGH-END
    Monday 12 January 2026
    Taiwan UPS specialist powers AI and semiconductor demand surge into 2026

    Changs Ascending Enterprise Co. (CAEC) reported strong shipments of its next-generation lithium iron phosphate (LFP) UPS battery systems...

    Monday 12 January 2026
    Honey Hope Honesty posts 16% growth on surging AI server MLCC demand
    Electronic component distributor Honey Hope Honesty Enterprise (3H) reported December 2025 revenue of NT$652 million (US$20.63 million), up 52.01% year over year. The strong growth...
    Sunday 11 January 2026
    LinkCom targets high-end networking as magnetic component sales rebound
    With the European telecom market recovering and countries accelerating network upgrade plans, magnetic component manufacturer LinkCom reported that shipments of PoE power transformers...
    Friday 9 January 2026
    Lite-on Technology sees 20% revenue growth in 2025, driven by power management systems
    Lite-on Technology reported consolidated global revenue of NT$14.9 billion (approx. US$473 million) for December 2025, reflecting a 5% increase from the previous month and an 11%...
    Friday 9 January 2026
    Dell reset PC strategy: XPS revival with AI-ready, ultra-thin laptops
    After a one-year hiatus, Dell announced the return of its high-end XPS notebook lineup at CES 2026, unveiling the thin-and-light XPS 14 and XPS 16 and previewing the thinnest XPS...
    Thursday 8 January 2026
    Largan likely to address CPO developments at January 8 conference call
    Largan Technology, a leading supplier of optical lenses, will hold its investor conference on January 8, drawing significant market interest following its December 2025 consolidated...
    Wednesday 7 January 2026
    Zhen Ding Tech ramps 10 plants as 2026 capex tops US$1.6bn
    Looking ahead to 2026, PCB industry leader Zhen Ding Tech. (ZDT) said demand remains solid across high-end applications such as AI servers, optical communications, and IC substrates,...
    Wednesday 7 January 2026
    CES 2026: MediaTek jumps early into Wi-Fi 8, kicking off the next wireless standards race
    At CES 2026, MediaTek unveiled its next-generation Wi-Fi 8 chipset platform, the Filogic 8000 series, moving ahead of rivals by declaring its position early in the next wireless standards...
    Wednesday 7 January 2026
    Taiwan's Fulltech moves to capture the high-margin glass fiber market due to shortages
    As demand for high-end applications such as artificial intelligence and 5G communications continues to build into 2026, concerns are mounting over persistent shortages of glass fiber...
    Tuesday 6 January 2026
    Chinese chipmakers confront yield challenges despite localization push
    China is speeding up efforts to localize its semiconductor supply chain to overcome US restrictions on high-end technology exports. Supply chain sources acknowledge that while Chinese...
    Friday 2 January 2026
    IC substrates and networking PCBs grow; materials and equipment face shortages
    The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
    Wednesday 31 December 2025
    BOE 8.6G AMOLED production line in Chengdu to begin production early
    BOE announced on December 30 that its first 8.6G AMOLED production line in Chengdu, China, has begun early production, five months ahead of the original schedule, shifting from construction...
    Tuesday 30 December 2025
    ARTERY Tech eyes drones, high-end MCUs before 2026 IPO

    Taiwan-based microcontroller supplier ARTERY Technology is sharpening its focus on edge artificial intelligence and drone-related applications...

    Tuesday 30 December 2025
    Commentary: Why China chose multi-accelerator strategy in AI chip development
    Facing US restrictions on high-end computing products, China is restructuring its AI chip industry by advancing GPU, TPU, and NPU technologies simultaneously. Domestic firms struggle...
    Friday 26 December 2025
    Honey Hope Honesty expects growing demand for high-end MLCCs driven by AI infrastructure in 2025 and 2026
    Electronic component distributor Honey Hope Honesty anticipates significant growth in sales of high-end multilayer ceramic capacitors (MLCCs) fueled by rising demand from AI servers...
    1/25 pages
    NTN special report
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
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