News tagged high-end at DIGITIMES

NEWS TAGGED HIGH-END

Sunday 11 January 2026

LinkCom targets high-end networking as magnetic component sales rebound

With the European telecom market recovering and countries accelerating network upgrade plans, magnetic component manufacturer LinkCom reported that shipments of PoE power transformers...

Friday 9 January 2026

Lite-on Technology sees 20% revenue growth in 2025, driven by power management systems

Lite-on Technology reported consolidated global revenue of NT$14.9 billion (approx. US$473 million) for December 2025, reflecting a 5% increase from the previous month and an 11%...

Friday 9 January 2026

Dell reset PC strategy: XPS revival with AI-ready, ultra-thin laptops

After a one-year hiatus, Dell announced the return of its high-end XPS notebook lineup at CES 2026, unveiling the thin-and-light XPS 14 and XPS 16 and previewing the thinnest XPS...

Thursday 8 January 2026

Largan likely to address CPO developments at January 8 conference call

Largan Technology, a leading supplier of optical lenses, will hold its investor conference on January 8, drawing significant market interest following its December 2025 consolidated...

Wednesday 7 January 2026

Zhen Ding Tech ramps 10 plants as 2026 capex tops US$1.6bn

Looking ahead to 2026, PCB industry leader Zhen Ding Tech. (ZDT) said demand remains solid across high-end applications such as AI servers, optical communications, and IC substrates,...

Wednesday 7 January 2026

CES 2026: MediaTek jumps early into Wi-Fi 8, kicking off the next wireless standards race

At CES 2026, MediaTek unveiled its next-generation Wi-Fi 8 chipset platform, the Filogic 8000 series, moving ahead of rivals by declaring its position early in the next wireless standards...

Wednesday 7 January 2026

Taiwan's Fulltech moves to capture the high-margin glass fiber market due to shortages

As demand for high-end applications such as artificial intelligence and 5G communications continues to build into 2026, concerns are mounting over persistent shortages of glass fiber...

Tuesday 6 January 2026

Chinese chipmakers confront yield challenges despite localization push

China is speeding up efforts to localize its semiconductor supply chain to overcome US restrictions on high-end technology exports. Supply chain sources acknowledge that while Chinese...

Friday 2 January 2026

IC substrates and networking PCBs grow; materials and equipment face shortages

The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...

Wednesday 31 December 2025

BOE 8.6G AMOLED production line in Chengdu to begin production early

BOE announced on December 30 that its first 8.6G AMOLED production line in Chengdu, China, has begun early production, five months ahead of the original schedule, shifting from construction...

Tuesday 30 December 2025

ARTERY Tech eyes drones, high-end MCUs before 2026 IPO

Taiwan-based microcontroller supplier ARTERY Technology is sharpening its focus on edge artificial intelligence and drone-related applications...

Tuesday 30 December 2025

Commentary: Why China chose multi-accelerator strategy in AI chip development

Facing US restrictions on high-end computing products, China is restructuring its AI chip industry by advancing GPU, TPU, and NPU technologies simultaneously. Domestic firms struggle...

Friday 26 December 2025

Honey Hope Honesty expects growing demand for high-end MLCCs driven by AI infrastructure in 2025 and 2026

Electronic component distributor Honey Hope Honesty anticipates significant growth in sales of high-end multilayer ceramic capacitors (MLCCs) fueled by rising demand from AI servers...

Monday 22 December 2025

Eternal Precision Mechanics commands 95% share of ABF vacuum press market

Eternal Precision Mechanics, a subsidiary of LCY Technology (Eternal Materials), has quietly become one of the most dominant players...

Thursday 18 December 2025

Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts

As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...

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Jan 6, 16:39

MSI Unveils Full Lineup of AI Products at CES 2026

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