IC backend houses have seen demand pick up recently for processing TV SoCs and chip solutions for set-top boxes (STB) and other household appliances while chip demand for handset...
Nvidia is currently still ahead of competitors in the server GPU market and saw its revenues from the datacenter business reach US$2.98 billion in 2019, nearly three times those of...
Taiwan-based Material Science Service (MSS), which provides IC material and failure analysis as well as FIB circuit repair/editing services, has entered the supply chain for TSMC's...
ABF substrate supply shortfalls are likely to widen further into 2021 as demand for 5G infrastructure, networking and high-end GPU and CPU applications has outgrown capacity expansions...
TSMC's 5nm technology will be offered in more process variants, including a further enhanced 5nm node in addition to 5nm Plus, according to sources at IC inspection services companies...
IC fabrication and backend materials distributors are expected to face a slowdown in shipments starting third-quarter 2020 at the earliest due mainly to impacts of the coronavirus...
Taiwan IC analysis and inspection labs are expected to see demand from US chipmakers and Huawei/HiSilicon weaken in the second half of the year on uncertainties arising from the coronavirus...
ABF substrates are expected to see long-term robust demand for processing high performance computing (HPC) GPU and CPU chips solutions as chipmakers are pursuing constant upgrades...
Graphics card manufacturers including Asustek Computer, Micro-Star International (MSI) and Gigabyte Technology are expected to see their shipments continue ramping up and grow through...
TSMC is mostly likely to turn out 5nm HPC chips for datacenter server applications at its planned 5nm fab in the US, and whether the move will push up server contract production in...
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
IC testing solution providers have recently enjoyed a ramp-up in orders for burn-in board orders for use in the manufacture of 802.11ax (Wi-Fi 6) and high-performance computing (HPC)...