Taiwan IC analysis and inspection labs are expected to see demand from US chipmakers and Huawei/HiSilicon weaken in the second half of the year on uncertainties arising from the coronavirus...

ABF substrates are expected to see long-term robust demand for processing high performance computing (HPC) GPU and CPU chips solutions as chipmakers are pursuing constant upgrades...

Graphics card manufacturers including Asustek Computer, Micro-Star International (MSI) and Gigabyte Technology are expected to see their shipments continue ramping up and grow through...

Memory module house Team Group expects to kick off volume shipments of industrial memory devices for use in HPC applications later in May.

TSMC is mostly likely to turn out 5nm HPC chips for datacenter server applications at its planned 5nm fab in the US, and whether the move will push up server contract production in...

As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...

Nan Ya PCB returned to profitability in the first quarter of 2020, driven by strong shipments of its high-end ABF substrates.

IC testing solution providers have recently enjoyed a ramp-up in orders for burn-in board orders for use in the manufacture of 802.11ax (Wi-Fi 6) and high-performance computing (HPC)...

Cooling fan maker Power Logic expects the upcoming rollouts of 7nm GPUs by AMD and Nvidia to drive its shipments for high-end graphics cards in the second half of 2020.

Unimicron Technology has seen clear order visibility for ABF substrates at least through the third quarter, with the orders mainly for 5G infrastructure, networking and HPC chips...

The coronavirus pandemic may force many Taiwan-based PCB makers to slow down their capacity expansion plans in the short term due to uncertain market prospects, but Zhen Ding Technology...

Taiwan's IC test interfaces vendors are enjoying a significant ramp-up in orders for high-end, customized test solutions from AMD and Nividia as the chipmakers are poised to roll...

Samsung Electronics is gearing up for mass production of 5nm chips later this year to further enhance its FinFET process offerings that leverage extreme ultraviolet (EUV) technolog...

TSMC has landed additional InFO (integrated fan-out) packaging orders requiring short lead times from MediaTek's Nephos, according to industry sources.

Nvidia and AMD are stepping up promotion of high performance computing (HPC) GPU chips solutions built on advanced nodes for server, AI and 5G applications and HiSilicon is also reportedly...