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Thursday 2 July 2020
SK Hynix starts mass production of high-speed DRAM
SK Hynix has announced the mass production of HBM2E DRAM, which was introduced in August 2019.
Tuesday 30 June 2020
Backend firms see demand for TV, STB chips pick up
IC backend houses have seen demand pick up recently for processing TV SoCs and chip solutions for set-top boxes (STB) and other household appliances while chip demand for handset...
Tuesday 30 June 2020
Nvidia, AMD see rising sales from server sector
Nvidia is currently still ahead of competitors in the server GPU market and saw its revenues from the datacenter business reach US$2.98 billion in 2019, nearly three times those of...
Wednesday 17 June 2020
IC analysis lab MSS enters TSMC supply chain
Taiwan-based Material Science Service (MSS), which provides IC material and failure analysis as well as FIB circuit repair/editing services, has entered the supply chain for TSMC's...
Friday 12 June 2020
ABF substrate shortages may widen into 2021
ABF substrate supply shortfalls are likely to widen further into 2021 as demand for 5G infrastructure, networking and high-end GPU and CPU applications has outgrown capacity expansions...
Tuesday 9 June 2020
TSMC 5nm technology said to be in more process variants
TSMC's 5nm technology will be offered in more process variants, including a further enhanced 5nm node in addition to 5nm Plus, according to sources at IC inspection services companies...
Thursday 28 May 2020
Backend material distributors warn of demand slowdown
IC fabrication and backend materials distributors are expected to face a slowdown in shipments starting third-quarter 2020 at the earliest due mainly to impacts of the coronavirus...
Tuesday 26 May 2020
IC analysis labs see slowdown in 2H20 demand from Huawei, US chipmakers
Taiwan IC analysis and inspection labs are expected to see demand from US chipmakers and Huawei/HiSilicon weaken in the second half of the year on uncertainties arising from the coronavirus...
Thursday 21 May 2020
ABF substrates in strong demand for HPC CPUs, GPUs
ABF substrates are expected to see long-term robust demand for processing high performance computing (HPC) GPU and CPU chips solutions as chipmakers are pursuing constant upgrades...
Thursday 21 May 2020
Graphics card makers see shipments boom
Graphics card manufacturers including Asustek Computer, Micro-Star International (MSI) and Gigabyte Technology are expected to see their shipments continue ramping up and grow through...
Wednesday 20 May 2020
Team Group shipping industrial memory devices for HPC applications
Memory module house Team Group expects to kick off volume shipments of industrial memory devices for use in HPC applications later in May.
Monday 18 May 2020
TSMC US fab plan may boost server production in North America
TSMC is mostly likely to turn out 5nm HPC chips for datacenter server applications at its planned 5nm fab in the US, and whether the move will push up server contract production in...
Monday 18 May 2020
TSMC may move mature CoWoS tech to US fab, say sources
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
Wednesday 13 May 2020
Nan Ya PCB swings to profit in 1Q20
Nan Ya PCB returned to profitability in the first quarter of 2020, driven by strong shipments of its high-end ABF substrates.
Tuesday 12 May 2020
Burn-in test demand for Wi-Fi, HPC chips surges
IC testing solution providers have recently enjoyed a ramp-up in orders for burn-in board orders for use in the manufacture of 802.11ax (Wi-Fi 6) and high-performance computing (HPC)...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research