Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...
Taiwan-based IC test interface solutions provide Chunghua Precision Test Tech (CHPT), mobile device certification specialist Sporton International, and testing house Sigurd Microelectronics...
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.
Macnica Galaxy, a Taiwan-based IC distribution arm of Japan's Macnica Group, has reported its first-half 2020 net profits soared 87.6% on year to a four-year high of NT$130 million...
Taiwan-based semiconductor material suppliers and distributors have enjoyed strong demand from their foundry clients for advanced-node manufacturing, and have seen clear order visibility...
Taiwan-based Nan Ya PCB saw its net profits soar nearly 80% sequentially to NT$833 million (US$28.36 million) in the second quarter of 2020, a sharp improvement from operating losses...
Taiwan's IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology are optimistic that their revenues for the third quarter of 2020 may grow 20% sequentially and profits may...
Chroma Ate, which provides integrated and customized solutions for test and measurement instruments, has reported net profits increased 24% sequentially to NT$580 million (US$19.8...
The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...
