Demand for high-end IC manufacturing materials remains robust with clear order visibility stretching into the third quarter of 2020, bolstered by growing adoption of advanced fabrication...
Unimicron Technology has seen clear order visibility for high-end IC substrates, especially ABF substrates for processing diverse HPC and networking chips, stretching to the third...
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
With the advent of the 5G era, global DRAM bit-based consumption is expected to approximately double by 2023, and wafer-level memory burn-in test services will become increasingly...
Taiwanese PCB makers, despite the coronavirus pandemic's impacts, still expect 5G handset demand to pick up later this year, and remain reluctant to move production out of China in...
China-based cloud service providers and server vendors are keenly developing ASIC chips solutions on their own, particularly those for 5G base stations and servers, providing new...
As part of their efforts to bolster economic development amid the ongoing coronavirus pandemic, many countries are stepping up establishment of 5G base stations and large-size datacenters,...
High-end high performance computing (HPC) chips solutions are entailing ever-rising packaging complexity along with their increasing applications to large-size datacenters and networking...
Backend and verification demand for ASICs, AI chips and HPC (high performance computing) chips from segments of 5G base stations, servers and datacenters has remained strong despite...
IC backend houses are enjoying stronger demand from 5G infrastructure, server and datacenter segments than the handset sector that is being increasingly hit by the fast spread of...
Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second...
Combined revenues of Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) are expected to drop 1.2% sequentially...
Despite global automotive semiconductor market being dominated by IDMs in Europe, the US and Japan, Taiwan's backend service leader ASE Technology Holding has been strengthening its...
Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies...
