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Thursday 12 March 2020
IC backend firms see strong demand from non-handset 5G segments
IC backend houses are enjoying stronger demand from 5G infrastructure, server and datacenter segments than the handset sector that is being increasingly hit by the fast spread of...
Wednesday 4 March 2020
TSMC advanced packaging capacity utilization to climb
Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second...
Monday 2 March 2020
Taiwan top-3 foundries to see combined revenues slip 1% in 1Q20, says Digitimes Research
Combined revenues of Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) are expected to drop 1.2% sequentially...
Monday 20 January 2020
ASE, IDMs teaming up to deepen deployments in auto IC modules
Despite global automotive semiconductor market being dominated by IDMs in Europe, the US and Japan, Taiwan's backend service leader ASE Technology Holding has been strengthening its...
Thursday 16 January 2020
TSMC showcases InFO_PoP packaging tech at Nepcon Japan 2020
Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies...
Monday 13 January 2020
EDA firm Ansys beefs up workorce in Taiwan
Ansys has increased its R&D workforce in Taiwan by 50% to support its local chipmaking partners, according to Roger Lee, company country manager for Taiwan.
Monday 6 January 2020
China AI chip development to spur ABF substrate capacity expansion
Taiwan IC substrate makers will have no time to lose in expanding their ABF substrate capacities as demand for such substrates will grow substantially in 2020 and beyond along with...
Monday 6 January 2020
CHPT sees vertical probe card biz expand
Chunghwa Precision Test Tech (CHPT) saw sales generated from its new VPC (vertical probe card) product line grow to account for a double-digit percentage of the company's total revenues...
Wednesday 25 December 2019
Foxconn offers HPC facility for use by cancer center
Foxconn Electronics has offered a high-performance computing (HPC) facility for use by National Taiwan University (NTU) Cancer Center, according to Yong Lin Health Care Foundation...
Monday 23 December 2019
China keen on developing AI-based ASICs
Chinese chipmakers are revving up development of HPC (high performance computing) chips for AI and deep learning applications, which are expected to become available for volume production...
Thursday 19 December 2019
Baidu, Samsung team up for AI chips
Baidu and Samsung Electronics have announced jointly that Baidu's first cloud-to-edge AI accelerator, Baidu Kunlun, has completed its development and will be mass-produced early next...
Monday 16 December 2019
TSMC teams up with MA-tek, iST on advanced IC analysis
Robust orders for advanced fabrication and packaging services at TSMC have prompted the foundry to team up with Materials Analysis Technology (MA-tek) and Integrated Service Technology...
Monday 16 December 2019
TSMC places test equipment orders with Teradyne
TSMC has placed orders for several hundred sets of test equipment with Teradyne, and will install the tools at the foundry's new advanced backend plant in northern Taiwan, according...
Thursday 12 December 2019
Global Unichip uses Cadence digital implementation and signoff flow to deliver designs for AI, HPC applications
Cadence Design Systems has announced that Global Unichip Corporation (GUC) successfully deployed its digital implementation and signoff flow and delivered advanced-node (N16, N12...
Friday 22 November 2019
Acter to gain from renewed IC plants construction in China in 2020
Taiwan-based clean room engineering specialist Acter is expected to see its revenues pick up steadily in 2020 as major clients in Taiwan and China will boost capex to step up major...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research