Taiwan-based IC design houses remain optimistic about demand for server peripheral chips, which will be further strengthened in the second half of 2020, according to industry sourc...
Taiwan's IC testing and certification service labs have seen orders from the non-Apple camp ramp up drastically for inspecting and analyzing HPC chips demanding advanced-node manufacturing,...
Taiwan-based IC substrates makers including Unimicron and Na Ya PCB are expected to see their capacities, especially those for ABF substrates, fully booked till fourth-quarter 2020,...
Demand for high-end IC manufacturing materials remains robust with clear order visibility stretching into the third quarter of 2020, bolstered by growing adoption of advanced fabrication...
Unimicron Technology has seen clear order visibility for high-end IC substrates, especially ABF substrates for processing diverse HPC and networking chips, stretching to the third...
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
With the advent of the 5G era, global DRAM bit-based consumption is expected to approximately double by 2023, and wafer-level memory burn-in test services will become increasingly...
Taiwanese PCB makers, despite the coronavirus pandemic's impacts, still expect 5G handset demand to pick up later this year, and remain reluctant to move production out of China in...
China-based cloud service providers and server vendors are keenly developing ASIC chips solutions on their own, particularly those for 5G base stations and servers, providing new...
As part of their efforts to bolster economic development amid the ongoing coronavirus pandemic, many countries are stepping up establishment of 5G base stations and large-size datacenters,...
High-end high performance computing (HPC) chips solutions are entailing ever-rising packaging complexity along with their increasing applications to large-size datacenters and networking...
Backend and verification demand for ASICs, AI chips and HPC (high performance computing) chips from segments of 5G base stations, servers and datacenters has remained strong despite...
IC backend houses are enjoying stronger demand from 5G infrastructure, server and datacenter segments than the handset sector that is being increasingly hit by the fast spread of...
Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second...
