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NEWS TAGGED HPC
Wednesday 26 June 2019
Unimicron, Na Ya to gain from high-specs ABF substrates in 2H19
The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Wednesday 5 June 2019
Unimicron, Kinsus to expand additional ABF substrate capacities
Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...
Wednesday 29 May 2019
Foxconn to build smart server plant in southern Taiwan
Foxconn Electronics (Hon Hai Precision Industry) will acquire a land plot in Kaohsiung for building a smart plant to make servers and related products, as part of its efforts to enhance...
Wednesday 15 May 2019
ABF substrate supply remains tight
The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.
Thursday 2 May 2019
ASE profits fall in 1Q19
ASE Technology Holding has reported net profit of NT$2.04 billion (US$66.2 million) for the first quarter of 2019, down 62% sequentially. EPS for the quarter came to NT$0.48.
Wednesday 24 April 2019
PTI remains focused on FOPLP for advanced logic ICs
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
Friday 19 April 2019
TSMC 7nm utilization to climb in 2H19, says CEO
TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...
Tuesday 26 March 2019
Advanced packaging to generate nearly US$3 billion in revenues in 2019, says TSMC chairman
Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...
Tuesday 12 March 2019
TSMC likely to post first annual profit drop in 8 years
Taiwan Semiconductor Manufacturing Company (TSMC) is likely to report an annual decrease in net profits this year, due to an even more saturated smartphone market and a slowdown in...
Thursday 21 February 2019
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the growth of mobile communications,...
Monday 11 February 2019
Apple supply chain: TSMC to remain sole iPhone chip supplier
Taiwan Semiconductor Manufacturing Company (TSMC) has given its cautious business and overall chip industry outlook this year, when the pure-play foundry is likely to remain the only...
Wednesday 23 January 2019
TSMC to tape out first 5nm chip design in 1H19
Despite its dim business and industry outlook this year, Taiwan Semiconductor Manufacturing Company (TSMC) continues to make progress in the development of sub-7nm process technologies...
Monday 21 January 2019
Acer stepping up efforts for AI hardware business in 2019
Acer so far in January 2019 has already obtained two procurement orders for high-performance computing (HPC) products for artificial intelligence (AI) applications and is looking...
Monday 14 January 2019
WPG, WT Micro post record 2018 revenues
IC distributors WPG and WT Microelectronics both saw their December revenues register double-digit sequential decreases, but their revenues for all of 2018 still hit record-high le...
Thursday 10 January 2019
2018 review and 2019 outlook: Heterogeneous chips integration spurs demand for system-3D backend solutions
Heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for SiP...