Taiwan's top IC backend specialist ASE Technology Holding has seen its SiP (system in package) business expand substantially so far this year amid growing demand for heterogeneous...
Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...
TSMC expects its third-quarter revenues to be driven mainly by growing demand coming from the smartphone and IoT sectors, and believes the fourth quarter will be even stronger thanks...
Taiwan Semiconductor Manufacturing Company (TSMC) expects to post consolidated revenues of between US$9.1 billion and US$9.2 billion in the third quarter of 2019, up about 18% sequentially...
Inspection equipment specialist Chroma ATE has signed a strategic cooperation MoU with Altair Engineering, under which the pair will work together to jointly develop tools for electric...
ASE Technology Holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is gearing up to tap business opportunities in...
The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...
Foxconn Electronics (Hon Hai Precision Industry) will acquire a land plot in Kaohsiung for building a smart plant to make servers and related products, as part of its efforts to enhance...
The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.
ASE Technology Holding has reported net profit of NT$2.04 billion (US$66.2 million) for the first quarter of 2019, down 62% sequentially. EPS for the quarter came to NT$0.48.
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...
Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...
