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Monday 7 May 2018
KYEC 1Q18 profits fall to 6-year low
IC testing specialist King Yuan Electronics (KYEC) saw its net profits fall to a 24-quarter low of NT$348 million (US$11.7 million) in the first quarter of 2018. EPS for the most...
Thursday 3 May 2018
Jetwell to list on Taiwan OTC market in late May
Taiwan-based Jetwell Computer is slated to list on the domestic over-the-counter (OTC) securities market in late May, seeking to source more public capital to support its one-stop...
Monday 30 April 2018
ASE 2Q18 revenues to surge 6-9% on brisk demand for HPC chips, car electronics
Taiwan's leading IC backend house Advanced Semiconductor Engineering (ASE) expects its revenues for the second quarter of 2018 to grow 6-9% sequentially and on year on strong market...
Thursday 26 April 2018
Wafer test specialist CHPT 1Q18 revenues surge 36% on quarter
Taiwan-based IC test equipment supplier Chunghwa Precision Test Tech (CHPT) has reported consolidated revenues of NT$740 million (US$24.90 million) for the first quarter of 2018,...
Wednesday 25 April 2018
TeraPower expecting car-use chip probing orders from Japan IDMs
TeraPower Technology, a re-invested chip probing affiliate of Taiwan's memory backend service specialist Powertech Technology (PTI), is actively tapping into the automotive electronics...
Friday 20 April 2018
TSMC cuts revenue outlook for 2018
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its revenue growth forecast for 2018 to 10% from the previously-estimated 10-15%, citing weaker-than-expected smartphone...
Thursday 19 April 2018
Taiwan IC designers asked to defer shipments of mining chips
Taiwan-based IC design houses have received requests from customers in the cryptocurrency mining sector to defer shipments of mining ASICs amid lackluster replacement demand for mining...
Thursday 12 April 2018
Xilinx gearing up for FPGA market
Bolstered by its programmability trait, FPGA (field-programmable gate array) is gaining ground in the field of high-performance computing (HPC) chips and artificial neural networks...
Tuesday 3 April 2018
TSMC advanced packaging seen crucial for HPC chips
The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...
Thursday 29 March 2018
Ardentec seeing orders for auto MCU ramp up
Taiwan-based Ardentec is expected to enjoy growing revenues generated from orders for automotive MCUs in 2018, according to industry sources. The IC testing company has seen orders...
Friday 23 February 2018
Samsung breaks ground on new EUV line in Hwaseong
Samsung Electronics has announced that it has broken ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to maintain its leadership in state-of-the-art semiconductor...
Tuesday 13 February 2018
NVM IP provider eMemory posts record revenues and profits for 2017
Taiwan-based eMemory, a developer and provider of embedded non-volatile memory (eNVM) technology, has reported net profits of NT$598 million (US$20.4 million) on consolidated revenues...
Thursday 8 February 2018
China IC backend houses vying for orders for mining ASICs
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
Wednesday 31 January 2018
CoWoS, SiP to be key packaging processes for AI chips
High performance computing (HPC) will become the most crucial platform in the development of process technologies for AI (artificial intelligence) chips, and CoWoS (chip on wafer...
Friday 19 January 2018
TSMC to see revenues rise 10-15% on HPC, IoT, 7nm orders in 2018
Taiwan Semiconductor Manufacturing Company (TSMC) will see its revenues grow 10-15% on year in 2018, mainly driven by the three major sectors of HPC (high performance computing),...