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Friday 20 September 2019
ASE building lights-out fabs to enhance high-end packaging
Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...
Wednesday 18 September 2019
PTI fan-out panel-level packaging attracts orders for HPC chips
Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...
Wednesday 18 September 2019
Huawei stepping up IC substrate purchases from Taiwan
Huawei is stepping up purchases of IC substrates from its Taiwan-based suppliers, including Unimicron Technology and Nan Ya PCB, according to industry sources.
Tuesday 17 September 2019
TSMC 7nm production lead time extended
The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand,...
Monday 16 September 2019
WinWay to thrive on robust demand for high-end IC sockets
As 7nm and more-advanced process nodes are increasingly applied to fabricating high-performance computing (HPC) CPUs and GPUs, demand for high-end IC sockets for SLT (system level...
Thursday 12 September 2019
Taiwan semiconductor foundry sector, 2Q19
With global market demand on a moderate increase in second-quarter 2019, Taiwan-based semiconductor foundries showed recovery. Taiwan Semiconductor Manufacturing Company (TSMC), United...
Tuesday 3 September 2019
Unimicron to step up investment for 5G, AI applications
Unimicron Technology has maintained its huge capex budgets for 2019 and 2020 are meant to strengthen its IC substrates technology upgrades and production capacity for the emerging...
Thursday 29 August 2019
Advantest positive about testing demand for 5G SoC, memory
Testing demand for high-end 5G SoCs has emerged and that for memory chips is set to pick up in early 2020, which will drive revenue increases at Advantest, a major Japan-based supplier...
Wednesday 21 August 2019
TSMC to see revenues surge in 2020
Growing chip demand for 5G- and AIoT-related applications will boost TSMC's revenues for 2020, which are expected to climb over 10% on year, according to industry sources.
Wednesday 14 August 2019
Unimicron to boost capex in 2020 to deepen ABF substrate deployment
PCB and IC substrate supplier Unimicron Technology has set aside a capex of approximately NT$16.2 billion (US$514.5 million) for 2020, up from NT$9.2 billion for 2019, to strengthen...
Monday 12 August 2019
TSMC gearing up for another semiconductor supercycle
The global semiconductor market is set to enter a dynamic new phase of growth, as the era of 5G network looms around the corner. TSMC, the world's largest pure-play foundry, is also...
Monday 12 August 2019
TSMC revenues slip in July
Taiwan Semiconductor Manufacturing Company (TSMC) has reported July consolidated revenues slipped 1.3% sequentially but grew 14% on year to NT$84.76 billion (US$2.7 billion).
Friday 9 August 2019
PCB makers to enjoy brisk ABF substrates demand for AMD new server CPU
Among Taiwan IC substrates makers, Unimicron and Na Ya PCB are expected to benefit the most from AMD release of its EPYC Rome 7002 server CPU adopting TSMC 7nm node and supporting...
Wednesday 7 August 2019
PCB makers increasing ABF substrate capacity
IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...
Monday 5 August 2019
US new tariffs on Chinese imports may dim TSMC, Intel prospects
The Trump administration's latest move to slap a 10% tariff on the remaining US$300 billion worth of Chinese imports, including handsets, notebooks and TVs, starting September 1 may...