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NEWS TAGGED HPC
Friday 18 October 2019
Robust 7nm and 5nm chip demand to drive TSMC 2020 growth
TSMC is set to enjoy another year of record-high sales in 2019, but net profits are unlikely to break the record high set last year due mainly to disappointing results during the...
Thursday 17 October 2019
TSMC expects 9% sales growth to hit another record in 4Q19
TSMC expects to enjoy another quarter of record high revenues, while adding an additional US$4 billion in its full-year capital budget. The pure-play foundry has forecast revenues...
Monday 14 October 2019
Unimicron, Na Ya 4Q19 revenues to grow on ABF substrates
Taiwan-based Unimicron and Na Ya PCB have both seen revenues for the third quarter of 2019 reach high levels thanks to robust shipments of ABF substrates, and the growth momentum...
Tuesday 8 October 2019
Global IC foundry output value to see 5.3% CAGR through 2024, says Digitimes Research
The global IC foundry industry output value will grow by a CAGR of 5.3% to reach US$75.42 billion in 2024, the final year of a five-year forecast period, driven by chip demand for...
Friday 4 October 2019
Global server shipment forecast, 2020 and beyond

Introduction

Friday 27 September 2019
Arm and TSMC demo 7nm Arm-based CoWoS chiplets for HPC
Arm and TSMC have announced jointly an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC's chip-on-wafer-on-substrate (CoWoS) advanced...
Thursday 26 September 2019
Qualcomm readies solutions to address 5G mmWave tech challenges
Construction of 5G mmWave base stations has been slow worldwide except in the US due to some major challenges affecting the development of related technologies, but Qualcomm has come...
Monday 23 September 2019
CHPT gains VPC orders from Israel, China
Chunghwa Precision Test Tech (CHPT) has gained new growth momentum as it has received new VPC (vertical probe card) orders from Israeli and Chinese clients for processing ASICs, AI...
Friday 20 September 2019
ASE building lights-out fabs to enhance high-end packaging
Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...
Wednesday 18 September 2019
PTI fan-out panel-level packaging attracts orders for HPC chips
Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...
Wednesday 18 September 2019
Huawei stepping up IC substrate purchases from Taiwan
Huawei is stepping up purchases of IC substrates from its Taiwan-based suppliers, including Unimicron Technology and Nan Ya PCB, according to industry sources.
Tuesday 17 September 2019
TSMC 7nm production lead time extended
The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand,...
Monday 16 September 2019
WinWay to thrive on robust demand for high-end IC sockets
As 7nm and more-advanced process nodes are increasingly applied to fabricating high-performance computing (HPC) CPUs and GPUs, demand for high-end IC sockets for SLT (system level...
Thursday 12 September 2019
Taiwan semiconductor foundry sector, 2Q19
With global market demand on a moderate increase in second-quarter 2019, Taiwan-based semiconductor foundries showed recovery. Taiwan Semiconductor Manufacturing Company (TSMC), United...
Tuesday 3 September 2019
Unimicron to step up investment for 5G, AI applications
Unimicron Technology has maintained its huge capex budgets for 2019 and 2020 are meant to strengthen its IC substrates technology upgrades and production capacity for the emerging...