FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...
High-end FPGA chips demand is mounting significantly for datacenter, 5G and AIoT applications, providing growth momentum for related wafer foundry, analysis and test players as well...
Intel, addressing the increasing use of heterogeneous architectures in high-performance computing, has announced a new category of discrete general-purpose GPUs optimized for AI and...
Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset...
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...
Taiwan-based IC testing interface supplier WinWay Technology has entered the supply chains of major chipmakers in the US and China with high-end customized IC sockets and will venture...
Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...
TSMC is set to enjoy another year of record-high sales in 2019, but net profits are unlikely to break the record high set last year due mainly to disappointing results during the...
TSMC expects to enjoy another quarter of record high revenues, while adding an additional US$4 billion in its full-year capital budget. The pure-play foundry has forecast revenues...
Taiwan-based Unimicron and Na Ya PCB have both seen revenues for the third quarter of 2019 reach high levels thanks to robust shipments of ABF substrates, and the growth momentum...
The global IC foundry industry output value will grow by a CAGR of 5.3% to reach US$75.42 billion in 2024, the final year of a five-year forecast period, driven by chip demand for...
Arm and TSMC have announced jointly an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC's chip-on-wafer-on-substrate (CoWoS) advanced...
Construction of 5G mmWave base stations has been slow worldwide except in the US due to some major challenges affecting the development of related technologies, but Qualcomm has come...
Chunghwa Precision Test Tech (CHPT) has gained new growth momentum as it has received new VPC (vertical probe card) orders from Israeli and Chinese clients for processing ASICs, AI...
